Reaction Process of Two-step Catalysation Pre-treatment for Electroless Plating on Non-conducting Substrates

Yamagishi, Kenji; Okamoto, Naoki; Mitsumata, N.; Fukumuro, Naoki; Yae, Shinji; Matsuda, Hitoshi

doi:10.1080/00202967.2004.11871571

Cited by 10 publications

(8 citation statements)

References 13 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…This deposition method has several advantages including cost, uniformity of films, and covering of complicated structures. This deposition requires catalyzation pretreatment of substrates generally using tin and palladium (1)(2)(3). For silicon (Si) substrates, obtaining adhesive metal films with conventional catalyzation pretreatments is difficult.…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Adhesive Metal Film Formation on Silicon by Electroless Deposition Using Catalytic Anchors

et al. 2010

View full text Add to dashboard Cite

Autocatalytic electroless deposition, which is a conventional method to metalize nonmetallic substrates, requires catalyzation of substrates before deposition. For silicon (Si) substrates, obtaining adhesive metal films with conventional catalyzation pretreatments is difficult. In this study, we develop a new method to produce adhesive metal films on Si substrates by an electroless process that consists of three steps: 1) electroless displacement deposition of metal nanoparticles; 2) Si nanopore formation by metal-particle-enhanced hydrofluoric acid etching; and 3) metal filling in nanopores and metal-film formation on the whole Si surface by autocatalytic electroless deposition. The metal nanorods in Si act as catalytic nanoanchors to promote autocatalytic electroless metal deposition and improve the adhesion of metal films on Si substrates.

show abstract

Section: Introductionmentioning

confidence: 99%

“…[1] and [2] (8); 2) Si nanopore formation by metal-particle-enhanced hydrofluoric acid (HF) etching expressed by Eqs. [2] and [3] (9,10); and 3) metal filling in nanopores and metal-film formation on the whole Si surface by autocatalytic electroless deposition: Electroless deposition of metal on Si:…”

Section: Introductionmentioning

confidence: 99%

Adhesive Metal Film Formation on Silicon by Electroless Deposition Using Catalytic Anchors

et al. 2010

View full text Add to dashboard Cite

show abstract

“…Sn 4+ ions precipitate as tin(IV) hydrates. 28) These indicate that the oxidation of Sn 2+ ions decreases the total amount of Sn ions or depletes Sn ions in the deposition bath. To inhibit the oxidation of Sn 2+ ions during sample preparation, we used malonic acid as a sacrificial reagent.…”

mentioning

confidence: 97%

Sulfide semiconductor materials prepared by high-speed electrodeposition and discussion of electrochemical reaction mechanism

Okamoto¹,

Kataoka²,

Saito³

2017

Jpn. J. Appl. Phys.

View full text Add to dashboard Cite

A manufacturing method for SnS using a one-step electrochemical technique was developed. The sulfide semiconductor was formed by electrodeposition using an aqueous bath at low temperatures. The sulfide semiconductor particles produced were characterized by X-ray diffraction (XRD) and scanning electron microscopy (SEM). The highest current density at which SnS was formed was 1800 mA/cm2 at a bath temperature of 293 K, which is 36 times larger than that in a previous deposition process. Analysis of the chronoamperometric current-time transients indicated that in the potential range from −1100 to −2000 mV vs saturated calomel electrode (SCE), the electrodeposition of SnS can be explained by an instantaneous nucleation model.

show abstract

“…Autocatalytic electroless deposition, which is the conventional method to metalize nonmetallic substrates [13,14], has several advantages including cost, uniformity of films, and covering of complicated structures. This deposition requires catalyzation pretreatment of substrates [13][14][15]. For Si substrates, obtaining adhesive metal films with conventional pretreatments is difficult.…”

mentioning

confidence: 99%

Catalytic nanopores for electroless deposition of adhesive metal films on silicon: Applications to various silicon substrates including multi‐ and micro‐crystalline

Yae

Sakabe

Hirano

et al. 2010

Phys. Status Solidi C

View full text Add to dashboard Cite

Metal‐particle‐assisted hydrofluoric acid etching of silicon (Si) is a unique method of preparing Si nanopores with metal nanoparticles at the bottom of each nanopore. Autocatalytic electroless deposition, which is the conventional method to metalize nonmetallic substrates, requires catalyzation of the substrates before deposition. For Si substrates, obtaining adhesive metal films with conventional catalyzation pretreatments is difficult. We recently developed a new method to produce adhesive metal films on Si substrates using catalytic nanopores that consists of three steps: 1) displacement deposition of metal nanoparticles; 2) Si nanopore formation by metal‐particle‐assisted hydrofluoric acid etching; and 3) autocatalytic electroless deposition of metal films. In this study, the new method is applied not only to previously reported p‐Si (100) 1 Ω cm substrates but also to various Si substrates, such as low and high resistibility, p‐ and n‐types, (100), (111), and (110) planes, and single‐, multi‐ and micro‐crystalline substrates. Adhesive and bright metal films were formed on all Si substrates. (© 2011 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)

show abstract

Reaction Process of Two-step Catalysation Pre-treatment for Electroless Plating on Non-conducting Substrates

Cited by 10 publications

References 13 publications

Adhesive Metal Film Formation on Silicon by Electroless Deposition Using Catalytic Anchors

Adhesive Metal Film Formation on Silicon by Electroless Deposition Using Catalytic Anchors

Sulfide semiconductor materials prepared by high-speed electrodeposition and discussion of electrochemical reaction mechanism

Catalytic nanopores for electroless deposition of adhesive metal films on silicon: Applications to various silicon substrates including multi‐ and micro‐crystalline

Contact Info

Product

Resources

About