2019
DOI: 10.1021/acs.langmuir.8b01419
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Reaction Temperature and Partial Pressure Induced Etching of Methylammonium Lead Iodide Perovskite by Trimethylaluminum

Abstract: Al 2 O 3 atomic layer deposition (ALD), which uses trimethylaluminum (TMA) as the metal precursor, shows promise in improving the environmental stability of hybrid halide perovskites. However, it is not yet entirely clear how TMA, a strong Lewis acid, reacts with fresh perovskites and how the reaction affects the nucleation of ALD Al 2 O 3 . Here, the effects of reaction temperature and partial pressure of TMA on the mechanisms of TMA/CH 3 NH 3 PbI 3 reactions are investigated. Our real time mass gain data and… Show more

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Cited by 13 publications
(13 citation statements)
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“…[26][27][28] Furthermore, by means of in situ quartz crystal microbalance (QCM) and IR spectroscopy, it was shown that the TMA molecules etch the CH 3 NH 3 PbI 3−x Cl x perovskite surface at 75°C. 27 A similar behavior was reported by Yu et al 29 Synchrotron XPS analysis was employed by Kot et al, 30 which indicated that the interaction of ALD precursors occurs only at the surface of the CH 3 NH 3 PbI 3 and FA 0.85 MA 0.15 Pb(Br 0.15 I 0.85 ) 3 perovskite (where FA corresponds to the formamidinium cation) during the growth of Al 2 O 3 at room temperature. 23,24 In parallel, they showed that there is covalent bonding at the CH 3 NH 3 PbI 3 /Al 2 O 3 interface.…”
Section: Introductionsupporting
confidence: 74%
“…[26][27][28] Furthermore, by means of in situ quartz crystal microbalance (QCM) and IR spectroscopy, it was shown that the TMA molecules etch the CH 3 NH 3 PbI 3−x Cl x perovskite surface at 75°C. 27 A similar behavior was reported by Yu et al 29 Synchrotron XPS analysis was employed by Kot et al, 30 which indicated that the interaction of ALD precursors occurs only at the surface of the CH 3 NH 3 PbI 3 and FA 0.85 MA 0.15 Pb(Br 0.15 I 0.85 ) 3 perovskite (where FA corresponds to the formamidinium cation) during the growth of Al 2 O 3 at room temperature. 23,24 In parallel, they showed that there is covalent bonding at the CH 3 NH 3 PbI 3 /Al 2 O 3 interface.…”
Section: Introductionsupporting
confidence: 74%
“…The quick and persistent mass gain from the TDMASn pulse exposure, however, suggests that the added mass during the pulse was a spontaneous and continuous reaction between the precursor and the perovskite surface (Figure S3 in the Supporting Information). A similar result was also shown in a previous study, where a modified surface was found in conjunction with a mass gain during the low partial pressure TMAl exposures of perovskite . The initial exposure of TDMASn during the ALD processes in this study was found to leave a surface that gave a smaller mass gain for the following SnO x cycles as compared to the film-on-film growth regime.…”
Section: Discussionsupporting
confidence: 91%
“…A similar result was also shown in a previous study, where a modified surface was found in conjunction with a mass gain during the low partial pressure TMAl exposures of perovskite. 13 The initial exposure of TDMASn during the ALD processes in this study was found to leave a surface that gave a smaller mass gain for the following SnO x cycles as compared to the film-on-film growth regime. Thus, after the initial exposure of TDMASn, there seems to be less-than-expected −DMA ligands at the surface, which would reduce the number of sites that H 2 O can react with and in turn would limit the amount of −OH groups that TDMASn can react with in the next pulse, effectively reducing the mass gain per cycle.…”
Section: Discussionmentioning
confidence: 59%
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“…Several studies have reported that excessive exposure to metal-organic ALD precursors can damage the perovskite material by etching away organic cations from the perovskite surface. [55][56][57][58] We used the same analysis to investigate the nucleation of ALD SnO 2 on C 60 that has been coated with a thin layer of PEIE. The thickness of the PEIE layer is approximately 2 nm as measured by spectroscopic ellipsometry and can be controlled by varying the concentration of the PEIE solution ( Figure S3).…”
Section: Resultsmentioning
confidence: 99%