2015
DOI: 10.1016/j.actamat.2014.12.037
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Reactions in a multilayered Si (substrate)/Ta/Mg/Fe/Ta/Pd thin-film structure during annealing and deuterium absorption

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Cited by 3 publications
(1 citation statement)
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“…There are a series of sputtering methods, for instance, according to the presence or absence of an applied magnetic field, sputtering is divided into magnetron sputtering and nonmagnetron sputtering; according to the type of current of power source, sputtering can be divided into direct current (DC) sputtering and radio frequency sputtering; according to the presence or absence of reactive gases during sputtering, sputtering is divided into reactive sputtering and non-reactive sputtering; according to the continuity of the current of power source, sputtering can be divided into continues sputtering and pulsed sputtering. [41][42][43][44][45][46][47][48][49][50][51] If the plasma is not generated by the bombardment of the particles, which are accelerated in the electric field, with the target, but by the interaction of pulsed laser with the target, then the deposition is called pulsed laser sputtering deposition or pulsed laser deposition (PLD). [52,53] For Mg-based thin films, hydrogenation can be achieved in two ways: air-exposed hydrogenation and plasma-based hydrogenation, which is realized in reactive sputtering.…”
Section: Methods For Preparing Mg-based Alloy Filmmentioning
confidence: 99%
“…There are a series of sputtering methods, for instance, according to the presence or absence of an applied magnetic field, sputtering is divided into magnetron sputtering and nonmagnetron sputtering; according to the type of current of power source, sputtering can be divided into direct current (DC) sputtering and radio frequency sputtering; according to the presence or absence of reactive gases during sputtering, sputtering is divided into reactive sputtering and non-reactive sputtering; according to the continuity of the current of power source, sputtering can be divided into continues sputtering and pulsed sputtering. [41][42][43][44][45][46][47][48][49][50][51] If the plasma is not generated by the bombardment of the particles, which are accelerated in the electric field, with the target, but by the interaction of pulsed laser with the target, then the deposition is called pulsed laser sputtering deposition or pulsed laser deposition (PLD). [52,53] For Mg-based thin films, hydrogenation can be achieved in two ways: air-exposed hydrogenation and plasma-based hydrogenation, which is realized in reactive sputtering.…”
Section: Methods For Preparing Mg-based Alloy Filmmentioning
confidence: 99%