Reactivity between Sn&amp;ndash;Ag Solder and Au/Ni&amp;ndash;Co Plating to Form Intermetallic Phases

Yamamoto, Takashi; Sakatani, Shigeaki; Kobayashi, Shinji; Uenishi, Koji; Kobayashi, Kojiro F.; Ishio, Masaaki; Shiomi, Kazuhiro; Hashimoto, Akio; Yamamoto, Masahiro

doi:10.2320/matertrans.46.2406

Cited by 17 publications

(8 citation statements)

References 4 publications

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“…A preliminary study of the Sn/Co solid/solid interfacial reaction found the formation of a distinctive cruciform pattern [7]. Though knowledge of the Sn/Co interfacial reactions is of interest to the electronic industry, only a few studies of the Sn/Co reactions [1,3,4,7,8] are available. This study thus examines reactions in the Sn/Co couples reacted at temperatures from 150 to 200 C to further understand the Sn/Co solid/solid interfacial reactions and their reaction kinetics.…”

Section: Introductionmentioning

confidence: 98%

Sn/Co solid/solid interfacial reactions

Wang

Chen

2008

Intermetallics

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Section: Introductionmentioning

confidence: 98%

Sn/Co solid/solid interfacial reactions

Wang

Chen

2008

Intermetallics

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“…Yamamoto et al have studied the interfacial reactions between Sn-Ag solder and Ni-20Co bond pads. 9 They found that the interfacial compound phase is the (Ni,Co)Sn 2 phase, rather than the common Ni 3 Sn 4 phase that forms at the solder/Ni interface. In this present work, we investigated the feasibility of using Ni-Co alloys as bond pads for Pb-free solders.…”

Section: Introductionmentioning

confidence: 98%

Study of Interfacial Reactions Between Sn(Cu) Solders and Ni-Co Alloy Layers

Huang

Shieu

Huang

et al. 2010

Journal of Elec Materi

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The interfacial reactions between electroplated Ni-yCo alloy layers and Sn(Cu) solders at 250 degrees C are studied. For pure Co layers, CoSn(3) is the only interfacial compound phase formed at the Sn(Cu)/Co interfaces regardless of the Cu concentration. Also, the addition of Cu to Sn(Cu) solders has no obvious influence on the CoSn(3) compound growth at the Sn(Cu)/Co interfaces. For Ni-63Co layers, (Co,Ni,Cu)Sn(3) is the only interfacial compound phase formed at the Sn(Cu)/Ni-63Co interfaces. Unlike in the pure Co layer cases, the Cu additives in the Sn(Cu) solders clearly suppress the growth rate of the interfacial (Co,Ni,Cu)Sn(3) compound layer. For Ni-20Co layers, the interfacial compound formation at the Sn(Cu)/Ni-20Co interfaces depends on the Cu content in the Sn(Cu) solders and the reflow time. In the case of high Cu content in the Sn(Cu) solders (Sn-0.7Cu and Sn-1.2Cu), an additional needle-like interfacial (Ni(x),Co(y),Cu(1-x-y))(3)Sn(4) phase forms above the continuous (Ni(x),Cu(y),Co(1-x-y))Sn(2) compound layer. The Ni content in the Ni-yCo layer can indeed reduce the interfacial compound formation at the Sn(Cu)/Ni-yCo interfaces. With pure Sn solders, the thickness of the compound layer monotonically decreases with the Ni content in the Ni-yCo layer. As for reactions with the Sn(Cu) solders, as the compound thickness decreases, the Ni content in the Ni-yCo layers increases

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“…Recently, Co and Co-based alloys were evaluated as potential materials for the underbump metallurgy (UBM) of IC chips, [1][2][3][4][5] because Co has acceptable solderability and exhibits higher Young's modulus and lower intermetallic compound (IMC) growth rate during solder reaction compared with Cu and Ni, which are the common materials used for UBM. 2 In flip-chip solder joints, the Cu/solder/Co sandwich structure is encountered.…”

Section: Introductionmentioning

confidence: 99%