We fabricated Cu core Sn-Ag solder balls by plating pure Sn and Ag on Cu balls and clarified that Sn/Ag plating began to melt at a rather low temperature, the eutectic temperature of Sn-Ag-Cu. This early melting at the eutectic temperature was ascribed to the diffusion of Cu and Ag into the Sn plating during the heating process. We investigated the solderability of the BGA joint with the Ni/Au coated Cu pad to compare it with that of the commercial Sn-Ag and Sn-Ag-Cu balls. After reflow soldering, we observed a eutectic microstructure composed of β-Sn, Ag 3 Sn, and Cu 6 Sn 5 phases in the solder, and a η -(Au, Cu, Ni) 6 Sn 5 reaction layer was formed at the interface between the solder and the Cu pad. The BGA joint using Cu core solder balls could prevent the degradation of joint strength during aging at 423 K because of the slower growth rate of the η -(Au, Cu, Ni) 6 Sn 5 reaction layer formed at the solder-pad interface. Furthermore, we were able to fabricate Cu-cored, multicomponent Sn-Ag-Bi balls by sequentially coating binary Sn-Ag and Sn-Bi solders onto Cu balls. The coated balls also exhibited almost the same melting and soldering behaviors as those of the previously alloyed Sn-2Ag-0.75Cu-3Bi solders.

For the formation of micro joint not to melt by secondary reflow soldering, we tried to enhance the reactivity of Sn-Ag solder with Au/Ni20Co plating. It was confirmed that the addition of Co in Ni and existence of Au plating effectively accelerated the reaction and the Sn-Ag solder completely transformed to the intermetallic compounds with a higher melting temperature.Particularly, the addition of Co in Ni changed the interfacial reaction layer from Ni 3 Sn 4 to (Ni,Co)Sn 2 with higher diffusivity of Ni which enhanced the formation of the intermetallic phases. This process is expected to replace the packaging technology using high temperature solders.

Hydrophobic silica xerogels containing trimethylsilyl (TMS) and dimethylsilyl (DMS) organic hydrophobic functional groups were synthesized using waterglass as the starting material. Five types of hydrophobic silica xerogels with varying surface coverages of the TMS and DMS groups were synthesized by changing the molecular structure of siloxane, which was used to introduce the hydrophobic moieties into the hydrogel and to investigate the resultant surface structures and thermal characteristics. The results revealed that the relative area of silica xerogels was smaller with a higher coverage of DMS groups. In addition, the thermal decomposition temperature of the silyl group shifted to higher temperatures, and the weight reduction during heating was also relatively limited in the above samples.

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