Real embedding process of SiC devices in a monolithic ceramic package using LTCC technology

Lenz, Christian; Ziesche, Steffen; Schletz, Andreas; Bach, Hoang Linh; Erlbacher, Tobias

doi:10.1109/estc48849.2020.9229653

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Ltcc Embedding Echnology T1

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2020

2024

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Cited by 4 publications

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“…The investigation w [6] as performed with three commercial LTCC materials: GT 951 (DuPont©), L8 (Ferro©) and 9k7 (DuPont©). These materials have a recommended firing temperature of 850 °C.…”

Section: Ltcc Embedding Echnology Tmentioning

confidence: 99%

Ceramic Embedding of SiC-Semiconductor Using Cofiring Technology

Ziesche,

Reinhardt,

Varghese

et al. 2024

IMAPSource Proceedings

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The presented work demonstrates our current state in embedding of SiC power electronic dies using Ceramic Multilayer Technology. The novelty of the approach presented includes the cofiring of a semiconductor element with ceramic base material, which demands for a reduced sintering temperature of ceramics (using LTCC or ULTCC based ceramics) in combination with an increased temperature stability of the semiconductor.

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Section: Ltcc Embedding Echnology Tmentioning

confidence: 99%