LTCC Embedding of SiC Power Devices for High Temperature Applications over 400 °C

Bayer, Benjamin; Groccia, Mario; Bach, Hoang Linh; Bayer, Christoph Friedrich; Schletz, Andreas; Lenz, Christian; Ziesche, Steffen

doi:10.1109/estc48849.2020.9229859

Cited by 5 publications

(3 citation statements)

References 9 publications

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“…To support the develop of a new packaging and integration technology of SiC devices into a monolithic ceramic package for high-power applications our work focuses on artifact minimized preparation and reliability investigation. This approach allows us to assess the inherent advantages of ceramics, such as high temperature stability, high insulation resistance, and high reliability, which are beneficial for SiC packaging concepts [3,4]. The main challenge for this technology trend is a functional integration of non-shrinking SiC devices into a structured ceramic multilayer laminate, which undergoes shrinkage during the sintering process.…”

Section: C Ase S Tudy 1: Embedded Sic Semiconductormentioning

confidence: 99%

Microstructural Based Reliability Investigation of Water- and Suspension Free Prepared Integrated Electronic Packages

Klengel,

Stephan

2024

IMAPSource Proceedings

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In micro- and power electronics reliability limiting mechanical and (electro-) chemical processes are increasingly caused by the complex structure of the systems, the material compositions and often heterogeneous mixtures of metals, polymers, and ceramics. Additionally, this causes challenging requirements for microstructural analyses and reliability characterization of materials, interfaces, components, and systems. Standardized metallographic routines are not suitable for high resolution analyses of corrosion products and mechanically sensitive systems. Focused ion beam preparation is limited in terms of dimension of the cross sectioned area. Therefore, we developed new preparation concepts by complete water- and suspension free preparation methods using laser and broad ion beam techniques. Two case studies for analyses of power electronic systems potted by inorganic materials and embedded SiC dies show the great potential of these methods for following microstructural analyses.

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Section: C Ase S Tudy 1: Embedded Sic Semiconductormentioning

confidence: 99%

Microstructural Based Reliability Investigation of Water- and Suspension Free Prepared Integrated Electronic Packages

Klengel,

Stephan

2024

IMAPSource Proceedings

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“…Some in particular (e.g. [6][7][8][9][10][11][12][13]) implement the power stage with specific 3D power packages, but do not integrate mixed analog and digital circuits, as required for closed-loop readback mechanisms in this work.…”

Section: Introductionmentioning

confidence: 99%

“…Other works on PCB also embed the dies of the power devices in the substrate by mounting it onto a core substrate or a carrier foil and then embedding it into a laminate [11,14,15]. With LTCC, the dies can be directly embedded inside the stack of LTCC sheets with cavities [8]. In thick-film technology, the substrate core is used to embed components [12].…”

Section: Introductionmentioning

confidence: 99%

Towards an LTCC SiP for Control System in Safety-Critical Applications

Nobert

Alameh

et al. 2021

2021 IEEE International Symposium on Circuits and Systems (ISCAS)

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This paper presents a compact configurable power control system for safety-critical applications, which operates in harsh environments. This heterogeneous integrated mixed digital, analog and high-voltage design for power applications is implemented in a system-in-package (SiP) module using a lowtemperature co-fired ceramics (LTCC) substrate. A comparison between technologies for SiP designs shows that LTCC is advantageous in terms of integration density, thermal and electrical performances, as well as signal and power integrity. In addition, this work proposes layout and fabrication techniques for the enhancement of thermal, electrical performances and integration density specific to LTCC-based designs, such as chipcovering, multi-layer routing of power signals and self-damped transmission lines. An improvement of 59% in available area, 32% reduction of temperature due to self-heating, 65% loss reduction and 22% reduction in interference coupling were obtained when compared to a baseline design.

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An FPGA-Based On-the-Fly Reconfigurable Low-Power SHEPWM Inverter With a Compact SiP Implementation

Aimaier,

Blaquière,

Constantin

et al. 2024

IEEE Trans. Power Electron.

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LTCC Embedding of SiC Power Devices for High Temperature Applications over 400 °C

Cited by 5 publications

References 9 publications

Microstructural Based Reliability Investigation of Water- and Suspension Free Prepared Integrated Electronic Packages

Microstructural Based Reliability Investigation of Water- and Suspension Free Prepared Integrated Electronic Packages

Towards an LTCC SiP for Control System in Safety-Critical Applications

An FPGA-Based On-the-Fly Reconfigurable Low-Power SHEPWM Inverter With a Compact SiP Implementation

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