2011
DOI: 10.1016/j.actamat.2010.08.023
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Real-time control of AlN incorporation in epitaxial Hf1−Al N using high-flux, low-energy (10–40 eV) ion bombardment during reactive magnetron sputter deposition from a Hf0.7Al0.3 alloy target

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Cited by 21 publications
(13 citation statements)
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“…With larger E i , the Si 2p binding energy shifts to higher values and Si bonding is dominated by more ionic Si-N bonds, resulting in a harder layer. With E i ≥ 50 eV, Si and Al concentrations decrease dramatically due to preferential resputtering of lighter elements, similar to that reported by Howe et al 26 for controlling the AlN incorporation probability in Hf 1−x Al x N films.…”
Section: Introductionsupporting
confidence: 70%
See 1 more Smart Citation
“…With larger E i , the Si 2p binding energy shifts to higher values and Si bonding is dominated by more ionic Si-N bonds, resulting in a harder layer. With E i ≥ 50 eV, Si and Al concentrations decrease dramatically due to preferential resputtering of lighter elements, similar to that reported by Howe et al 26 for controlling the AlN incorporation probability in Hf 1−x Al x N films.…”
Section: Introductionsupporting
confidence: 70%
“…This is consistent with the observations of Howe et al who demonstrated real-time control of the AlN concentration in epitaxial pseudobinary Hf 1−x Al x N(001) layers grown from a single Hf 0.7 Al 0.3 alloy target. 26 The AlN incorporation probability varied dramatically (> 200×) due to bombardment of the growing films with high-flux, low-energy ions dur- ing deposition in which E i ranged from 10 to 80 eV. The large ion-to-metal flux ratio, J i /J M e = 8, used in both Howe et al's and the present experiments, results in amplification of the Al and Si resputter yields from the growing film due to the high density of short, overlapping, and nearly isotropic collision cascades.…”
Section: A Hfalsin Film Growth and Nanostructurementioning
confidence: 99%
“…The chemical driving force for the isostructural decomposition into binary cubic nitrides is high since the mixing enthalpy is almost twice as big as in Ti 1−x Al x N, see Figure 2.3 [58,59]. The maximum amount of AlN soluble in Hf 1−x Al x N is reported to be x ≈ 0.5 [25,60,61]. From X-ray diffraction patterns, it is found that the cubic phase is maintained up to x = 0.33, then an amorphous or nanocrystalline material is obtained between x = 0.38 and 0.71, while from x = 0.77 wurtzite single phase field is formed [59].…”
Section: Ternary Pseudo-binary Nitride Alloysmentioning
confidence: 99%
“…The preferential removal of lighter Al atoms is explained by forward sputtering by recoiled Ar + ions that are neutralized and backscattered from heavy Hf atoms. 44,196 In our study, we wanted to extend this technique to vary both the AlN and SiN concentrations in Hf1−x−yAlxSiyN, and grow amorphous films. Then, I would grow alternating amorphous Hf-Al-Si-N and nanocrystalline HfN layers using a single Hf0.6-Al0.2Si0.2 alloy target, by just varying the ion energy.…”
Section: Paper Vmentioning
confidence: 99%