As
an excellent semiconductor material with low band gap and high
carrier mobility, germanium is widely used in the semiconductor industry
in photoelectronic devices, high-frequency radio frequency (rf) circuits
and devices, etc. Compared to bulk germanium wafer and silicon-based
germanium on insulator (GOI) materials, the germanium on sapphire
(GOS) substrate offers a highly cost-effective solution with several
important advantages, including low thermal expansion coefficient
mismatch, high insulator resistivity,
lower rf losses, and superior crosstalk suppression. In this work,
we present a method to grow a high-quality thin germanium epitaxial
film on a sapphire (0001) substrate using direct-current (DC) sputtering
at an elevated temperature of 600 °C. We demonstrate that thermal
annealing at 850 °C reduced the germanium (111) twinning, increased
the size of crystalline domains in the germanium film and thus further
improved the crystalline quality. For a film with a thickness of 500
nm, the hole Hall mobility increased to 440 cm2/V·s
after thermal annealing, which is about 10 times more than that of
the as-sputtered film. For a 2.0 μm film, the hole Hall mobility
increased to 824 cm2/V·s, which has not been reported
in the literature for a GOS film. This method offers a simple but
efficient way to fabricate a GOS substrate for optical electronic
device applications.