involving material exploration, structure design, and fabrication innovation. [6][7][8][9][10][11] Currently, flexible EES devices are fabricated through two main strategies: i) Utilization of intrinsic flexible materials. For example, carbon materials and conductive polymers are widely applied as EES electrodes, and polymers like Nafion, polyacrylamide (PAM), and polyethylene oxide (PEO) are used as electrolytes, and polymer matrixes such as polydimethylsiloxane (PDMS), polyimide (PI) are used as substrates or packing materials; [12][13][14][15] ii) Taking advantage of deformable structures. In this aspect, it has been demonstrated that the rigid materials can be endowed with flexibility after they are transformed from bulk to thin films or fibers, or are configured into such structures where stretching can be altered to bending motions, for example, serpentine, wavy and rigid island structures. [16][17][18] To maximize the flexibility of EES devices, it is desired to combine the aforementioned two strategies by constructing the intrinsically flexible EES materials in deformable structures. To optimize the performance of a flexible electronic system, it is also desired to integrate the EES devices with other functional units in well-designed mechanical structures. This has brought a big challenge to the manufacturing of flexible electronics since traditional manufacturing methods are insufficient in the structure design.Modern printing methods, such as 3D printing, screen printing, and inkjet printing, which exhibit high-degree flexibility pattern writing, provide new opportunities for manufacturing flexible EES devices as well as other electronic devices. 3D printing, also known as additive manufacturing technology, enables fabricating of EES electrodes and solid electrolytes in well-designed 3D architectures by stacking functional materials layer by layer. [19][20][21][22] However, increasing the printing dimension raises challenges for device flexibility, resulting in critical limitations in material selection and complex material processing. [23] Moreover, the highcost of 3D printing instruments and big trade-off between printing speed and resolution make 3D printing difficult to be applied in the manufacturing of integrated flexible electronic devices. [24] Screen printing is an industrial printing technique that can form EES electrodes in pre-designed patterns on flexible substrates by dragging material inks across a screen with meshes. The typical thickness of screen-printed film is about 10 µm. [25][26][27] The screen printing process is