a high fracture strain of at least 10% [10] make MoS 2 and other 2D semiconductors good candidates for applications in flexible electronic devices and circuits. [11] However, several technical challenges need to be overcome before flexible devices based on 2D materials become widely available. Among them, a stable and controllable doping method that is compatible with flexible substrates and low processing temperatures should be developed. Strategies based on exposure to plasma, intercalation, and implantation were only demonstrated on multilayer MoS 2 [12][13][14] which is less interesting for optoelectronic applications due to its indirect bandgap. Substitutional doping with, for example, rhenium or niobium during CVD growth result in doping levels that cannot be modified after growth and are difficult to implement locally and selectively. [15,16] Chemical doping on the other hand, can be easily implemented due to the large surface to volume ratio of 2D materials. [17] Various molecular surface doping methods based on wet chemical treatment have been widely explored, but most of them are not air-stable and are difficult to control. [18][19][20][21] While doping strategies based on functionalizing 2D materials with noble metal nanoparticles offer air stability, they do not result in good uniformity. [22,23] Stable and controllable doping could be achieved using Cs 2 CO 3 thin films by varying the film thickness [24] or phosphorus silicate glass (PSG) substrates through thermal and optical activation; [25] however, brittle Cs 2 CO 3 films and PSG substrates are not suitable for flexible electronics. So far, a practical technique for achieving air-stable and controllable doping of MoS 2 using materials and processes that are compatible with flexible electronics is missing.An effective encapsulation layer with good gas barrier performance is another key enabler for flexible devices based on MoS 2 and other 2D semiconductors. It is well known that the performance of MoS 2 FETs degrades in air due to surface adsorption of O 2 and H 2 O. [26][27][28] Al 2 O 3 , HfO 2 , and other high-κ inorganic dielectrics have been commonly used as encapsulation layers for layered 2D devices. [2,29] However, their brittleness makes them undesirable for applications in flexible electronics, where the encapsulation layer usually experiences the highest strain under bending. Hexagonal boron nitride, a layered insulating material, is a promising candidate for encapsulation of other 2D materials due to the clean and smooth interface free of dangling bonds, but encapsulation is performed using a material transfer process which has so far been restricted to laboratory scale. [30][31][32] Favorable mechanical and electrical properties motivate the use of 2D semiconductors in flexible electronic devices. One of the main challenges here is the absence of a practical doping strategy which should provide air-stable, tunable doping levels in a process with a low thermal budget. Here, it is shown that SU8, an epoxy-based photoresist, can be used ...