Recent advances in focused ion beam technology and applications

Bassim, Nabil; Scott, Keana C.; Giannuzzi, Lucille A.

doi:10.1557/mrs.2014.52

Cited by 134 publications

(105 citation statements)

References 122 publications

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“…In the last decade, the slice-and-view tomographic method employing a focused ion beam (FIB) instrument combined with an scanning electron microscope (SEM) (a FIB-SEM) [13][14] became a common way to characterize the 3D geometry and composition of a variety of materials from the nanoscale (nm) to the microscale (µm) [15][16][17][18]. In this article we describe a simple, scalable, low-cost, hands-on activity that introduces students to microscopy and tomography.…”

Section: Introductionmentioning

confidence: 99%

Destructive Tomography of Red Cabbage and Swiss Cheese: FIB-SEM Themed Educational Outreach

2017

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In this article we describe a simple, scalable, low-cost, and hands-on activity that introduces students to microscopy and "destructive tomography." Specifically, we show that 2D images of sequential cross sections of several foods can be quickly reconstructed into a volumetric data set, shared, and interactively explored online using simple and fast image processing. We describe the entire process and present the results of destructive tomography of red cabbage and Swiss cheese as well as describe our experience with implementation of this activity in a local middle school.

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Section: Introductionmentioning

confidence: 99%

Destructive Tomography of Red Cabbage and Swiss Cheese: FIB-SEM Themed Educational Outreach

2017

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“…Charged particle beams of controlled energy and strong focusing are widely used tools in industry and science [1]. State-of-the-art machines provide the possibility of modifying, analysing and imaging different objects and materials from the micro to the nano scale.…”

Section: Introductionmentioning

confidence: 99%

Ion microscopy based on laser-cooled cesium atoms

Viteau¹,

Reveillard²,

Kime³

et al. 2016

Ultramicroscopy

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We demonstrate a prototype of a Focused Ion Beam machine based on the ionization of a lasercooled cesium beam adapted for imaging and modifying different surfaces in the few-tens nanometer range. Efficient atomic ionization is obtained by laser promoting ground-state atoms into a target excited Rydberg state, then field-ionizing them in an electric field gradient. The method allows obtaining ion currents up to 130 pA. Comparison with the standard direct photo-ionization of the atomic beam shows, in our conditions, a 40-times larger ion yield. Preliminary imaging results at ion energies in the 1-5 keV range are obtained with a resolution around 40 nm, in the present version of the prototype. Our ion beam is expected to be extremely monochromatic, with an energy spread of the order of 1 eV, offering great prospects for lithography, imaging and surface analysis.

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“…More recently, dual-beam FIB-SEMs with inductively-coupled Xe plasma ion sources have been developed. Such plasma FIB (PFIB) columns give much higher material removal rates, and the Xe ions produce very different types of damage, which makes PFIB instruments much more suitable for certain types of sample [1,2].In our work, we have investigated the relative advantages of Ga FIB and Xe PFIB technologies for various types of samples. Results on ceramic coatings with hierarchical porosity are reported elsewhere [3], and here we consider complex Al alloy systems.…”

mentioning

confidence: 99%

A Comparison of Ga FIB and Xe-Plasma FIB of Complex Al Alloys

2017

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Remarkable advances have been made in dual-beam focused ion beam -scanning electron microscopy (FIB-SEM) technologies over the last 20 years. Such FIB-SEMs can now be used to perform a wide variety of microstructural characterization and microfabrication experiments. The incorporation of X-ray spectrometry, electron back-scattered diffraction (EBSD) and in situ lift out capabilities into dual-beam FIB-SEMs make them one of the most powerful instruments for the analysis of microstructure in materials. The vast majority of these instruments are equipped with Ga liquid metal ion sources, and the latest generation Ga FIB columns are extremely powerful and versatile. The main drawbacks of Ga FIB are the limits on the maximum material removal rate, issues with amorphization for certain types of sample, and the possibility of chemical reactions between Ga and the specimen. Such issues cause particular problems for metallurgical samples, because some metals interact strongly with Ga and the important processes often occur on length scales that are not accessible by Ga FIB. More recently, dual-beam FIB-SEMs with inductively-coupled Xe plasma ion sources have been developed. Such plasma FIB (PFIB) columns give much higher material removal rates, and the Xe ions produce very different types of damage, which makes PFIB instruments much more suitable for certain types of sample [1,2].In our work, we have investigated the relative advantages of Ga FIB and Xe PFIB technologies for various types of samples. Results on ceramic coatings with hierarchical porosity are reported elsewhere [3], and here we consider complex Al alloy systems. It has been shown previously by Unocic et al. that Ga FIB milling of Al alloys can lead to Ga accumulation at surfaces, grain boundaries, and interphase boundaries [4]. The sample used for this study was a 150 µm thick cold-sprayed coating of an Al-Cr-Mn-Co-Zr alloy on an Al 6061 alloy substrate. The complex alloy used for the coating exhibits a hard, quasi-crystal reinforced microstructure [5]. The microstructures of the coating and substrate were investigated using two FEI Helios NanoLab FIB-SEMs: a 460F1 Ga FIB and a Xe PFIB.The most obvious difference between the two FIB columns is the milling rate achievable. To illustrate this, trenches were cut into the coating, and the trench walls were examined to reveal the microstructure in cross-section. Examples of secondary electron SEM images obtained from trenches cut using the Ga FIB and the PFIB are shown in Figures 1a and b, respectively. The trenches have approximately the same dimensions (17 µm wide and 10 µm deep) and were produced using the highest ion beam currents that did not result in excessive damage. The milling times for the two trenches were 26 and 4 minutes for the Ga FIB and PFIB, respectively. While the curtaining on the PFIB cuts was more pronounced, the nearsurface damage was far less than that for Ga FIB. Following Burnett et al. [2] we evaluated this damage using EBSD on sections cut through the Al 6061 substrate. Examples of ...

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Recent advances in focused ion beam technology and applications

Cited by 134 publications

References 122 publications

Destructive Tomography of Red Cabbage and Swiss Cheese: FIB-SEM Themed Educational Outreach

Destructive Tomography of Red Cabbage and Swiss Cheese: FIB-SEM Themed Educational Outreach

Ion microscopy based on laser-cooled cesium atoms

A Comparison of Ga FIB and Xe-Plasma FIB of Complex Al Alloys

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