Recent Advances in Machining of Silicon Wafers for Semiconductor Applications

Sreejith, P. S.; Udupa, Ganesha; Noor, Y.B.M.; Ngoi, B. K. A.

doi:10.1007/s001700170185

Cited by 38 publications

(17 citation statements)

References 17 publications

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“…There is a mechanism to feed the ingot (or the blade) toward the blade (or the ingot). More information about ID sawing can be found in the literature [14,23,[71][72][73][74][75].…”

Section: Interrelationship Between Grinding and Slicingmentioning

confidence: 99%

“…There exist numerous articles on grinding of silicon wafers, including several review papers [14][15][16][17][18][19]. However, most research papers were focused on individual aspects of silicon wafer grinding; none of the review papers presented any historical views on grinding in manufacturing of silicon wafers; and there was little discussion in the literature on the interrelationships between grinding and other machining processes for silicon wafers.…”

Section: Introductionmentioning

confidence: 99%

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Grinding of silicon wafers: A review from historical perspectives

Pei

Fisher

Liu

2008

International Journal of Machine Tools and Manufacture

159

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The majority of semiconductor devices are built on silicon wafers. Manufacturing of high quality silicon wafers involves several machining processes including grinding. This review paper discusses historical perspectives on grinding of silicon wafers, impacts of wafer size progression on applications of grinding in silicon wafer manufacturing, and interrelationships between grinding and two other silicon machining processes (slicing and polishing). It is intended to help * Corresponding author. Tel.: +1 785 532 3436; fax: +1 785 532 3738. E-mail address: zpei@ksu.edu (Z.J. Pei). 1 readers to gain a more comprehensive view on grinding of silicon wafers, and to be instrumental for research and development in grinding of wafers made from other materials (such as gallium arsenide, germanium, lithium niobate, sapphire, and silicon carbide).

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“…There is a mechanism to feed the ingot (or the blade) toward the blade (or the ingot). More information about ID sawing can be found in the literature [14,23,[71][72][73][74][75].…”

Section: Interrelationship Between Grinding and Slicingmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Grinding of silicon wafers: A review from historical perspectives

Pei

Fisher

Liu

2008

International Journal of Machine Tools and Manufacture

159

View full text Add to dashboard Cite

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“…Inner diameter (ID) blades have been used for slicing a silicon ingot [1,2]. It is very hard to slice the large ingot because the diameter of the ID blade is usually very large, for example over 1 m for 8-inch wafers.…”

Section: Introductionmentioning

confidence: 99%

“…Today, saw wires are increasingly used because of a low kerf loss and applicable to cutting a large silicon ingot [3][4][5][6]. A fixed-abrasive saw wire is preferable to improve the machining speed, especially an electrodeposited saw wire with diamond grits because the post-process to remove the slurry containing the abrasive is unnecessary.…”

Section: Introductionmentioning

confidence: 99%

A desktop saw wire coating machine by using electrical discharge machining

Furutani

Suzuki

2009

2009 IEEE International Conference on Control and Automation

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This paper deals with a fabrication machine of a saw wire by electrical discharge machining (EDM). To solve problems in the fabrication of a fixed-abrasive saw wire, a deposition method by EDM with a compressed WC-Co powder working as an electrode has been proposed. At first, electrical conditions and electrode motion for the fabrication process of a hard layer on the thin wire by EDM were experimentally investigated. Then a prototype of the desktop fabrication machine was built. Four electrode feeding devices with a combination of a lead screw and a stepping motor were arranged on each side of a square working tank. The electricity was supplied to the electrodes by switching every 2 s. A long saw wire with the tungsten carbide layer could be fabricated. The deposited wire endured the same cutting load as the electrodeposited saw wire. Brittle materials such as glass and basalt could be cut with the fabricated saw wire.

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“…As a consequence, a subsequent finishing process, such as chemical mechanical polishing (CMP), is required to remove the damaged layer [8]. Although well accepted in silicon wafer foundry, CMP has extremely low efficiency on material removal, the CMP solution can cause pollution to environment, and the process is difficulty to be automated [9,10]. Those disadvantages become more severe with the increased wafer size [11,12].…”

Section: Introductionmentioning

confidence: 99%

Surface integrity and removal mechanism of chemical mechanical grinding of silicon wafers using a newly developed wheel

Dong

Gao

Huang

et al. 2015

Int J Adv Manuf Technol

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A chemical mechanical grinding (CMG) wheel was developed for planarization of silicon wafers, which consists of magnesium oxide (MgO) abrasives and calcium carbonate (CaCO 3 ) additives, mixed with 25 % weight percentage of magnesium chloride (MgCl 2 ) solution. It was shown that chemical reactions occurred during the grinding process, which formed a softened layer on the top of silicon substrate. The reactants could be much more easily removed by mechanical abrasion than the removal of Si phase itself. The newly developed wheel was able to produce a similar surface integrity to that obtained from chemical mechanical polishing (CMP), i.e., the CMG achieved a surface roughness of 0.5 nm in R a and a subsurface damage layer of 13 nm thick. The CMG process developed thus has great potential for back grinding or thinning of silicon wafers in order to replace CMP.

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Recent Advances in Machining of Silicon Wafers for Semiconductor Applications

Cited by 38 publications

References 17 publications

Grinding of silicon wafers: A review from historical perspectives

Grinding of silicon wafers: A review from historical perspectives

A desktop saw wire coating machine by using electrical discharge machining

Surface integrity and removal mechanism of chemical mechanical grinding of silicon wafers using a newly developed wheel

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