Recent advances on SnBi low-temperature solder for electronic interconnections

Jiang, Nan; Zhang, Liang; Gao, Lili; Song, Xiaojie; He, Peng

doi:10.1007/s10854-021-06820-7

Cited by 43 publications

(9 citation statements)

References 81 publications

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“…6 shows the results of TEM analysis of the interface between the Sn-1.5Ag-2.0Zn alloy solder and the polycrystalline copper substrate at 160 °C for 300 h. The selected electron diffraction pattern in the A region corresponds to Cu 6 Sn 5 with a crystalline band axis of [0 1 0]. The selected electron diffraction pattern in the C region corresponds to Cu 6 Sn 5 with a crystalline band axis of [ [2] , [3] , [4] , [5] , [6] , [7] , [8] , [9] , [10] , [11] , [12] ], and the selected electron diffraction pattern in the B region corresponds to Cu 5 Zn 8 with a crystalline band axis of [0−1 0]. It can be found that the rod-shaped particles A-phase Cu 6 Sn 5 and B-phase Cu 5 Zn 8 are grown in polycrystalline copper substrate nucleation.…”

Section: Results and Analysismentioning

confidence: 99%

“…Moreover, the poor thermal workability and creep resistance of tin-lead solder cannot meet the requirements of packaging technology development. Researchers have been searching for lead-free solders that can match the performance of Sn–Pb solders [ [7] , [8] , [9] , [10] ]. The Sn–Ag system is currently recognized as the most desirable lead-free solder.…”

Section: Introductionmentioning

confidence: 99%

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Interfacial reaction of Sn-1.5Ag-2.0Zn low-silver lead-free solder with oriented copper

Xiao,

Cheng,

Fu-kang

2024

Heliyon

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Section: Results and Analysismentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Interfacial reaction of Sn-1.5Ag-2.0Zn low-silver lead-free solder with oriented copper

Xiao,

Cheng,

Fu-kang

2024

Heliyon

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“…To improve the properties of the different alloys, additional alloying elements can be incorporated. Jiang, N et al [ 53 ] reviewed different alloys based on Sn-Bi, reporting more than 40 alloys, including alloy 50Sn-35Bi-12I, which had a melting point of 100 °C and was the one with the lowest temperature obtained. Table A1 shows some of the main commercial solder pastes between 100 °C and 200 °C, their alloys, and their corresponding liquidus and solidus temperatures.…”

Section: Methodsmentioning

confidence: 99%

Low-Temperature Soldering of Surface Mount Devices on Screen-Printed Silver Tracks on Fabrics for Flexible Textile Hybrid Electronics

Silvestre

Llopis

Rodrigo

et al. 2022

Sensors

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The combination of flexible-printed substrates and conventional electronics leads to flexible hybrid electronics. When fabrics are used as flexible substrates, two kinds of problems arise. The first type is related to the printing of the tracks of the corresponding circuit. The second one concerns the incorporation of conventional electronic devices, such as integrated circuits, on the textile substrate. Regarding the printing of tracks, this work studies the optimal design parameters of screen-printed silver tracks on textiles focused on printing an electronic circuit on a textile substrate. Several patterns of different widths and gaps between tracks were tested in order to find the best design parameters for some footprint configurations. With respect to the incorporation of devices on textile substrates, the paper analyzes the soldering of surface mount devices on fabric substrates. Due to the substrate’s nature, low soldering temperatures must be used to avoid deformations or damage to the substrate caused by the higher temperatures used in conventional soldering. Several solder pastes used for low-temperature soldering are analyzed in terms of joint resistance and shear force application. The results obtained are satisfactory, demonstrating the viability of using flexible hybrid electronics with fabrics. As a practical result, a simple single-layer circuit was implemented to check the results of the research.

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“…SnPb solder is widely used in electronic packaging due to its low price, good wettability, and low melting point. , However, the European Union passed the Waste Electrical and Electronic Equipment (WEEE) and Restriction of Hazardous Substance (ROHS) directives to ban the use of Pb in electronic products due to its toxicity. , Therefore, the research on lead-free solder has become a hot topic. At present, the main lead-free solders include SnCu, SnAgCu, SnAg, SnBi, and SnZn. − SnCu solder is considered a good substitute for SnPb solder for its low cost, low resistivity, and excellent mechanical properties . However, the formation of excessively thick scalloped intermetallic compounds (IMCs) at the Sn-0.7Cu/Cu interface during the soldering process can easily make the solder joints break and cause malfunction, thereby affecting the service life of electronic equipment. , …”

Section: Introductionmentioning

confidence: 99%

Effects of Co Nanoparticles Embedded in Carbon Skeleton Nanosheet Addition to Sn-0.7Cu Solder on the Interfacial Reaction

Gao

Lin

et al. 2023

ACS Appl. Nano Mater.

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The application of Sn-0.7Cu solder in electronic packaging is limited by its high melting point, low wettability, and poor solderability. Herein, we obtain Co nanoparticles embedded in carbon skeleton nanosheets (Co&C) via a metal-organicframework (MOF)-derived method. The composite solder is successfully prepared by adding Co&C into Sn-0.7Cu. The results show that the addition of minor amounts of Co&C has little influence on the melting point of the composite solder. In addition, the wettability of the composite solder is effectively enhanced by the adsorption effect of Co&C. The minimum wetting angle of the composite solder is 27.9°when the content of Co&C is 0.08 wt %. With the addition of Co&C, the microstructure of the solder is refined, and the best refinement effect is achieved when the content of Co&C is 0.08 wt %. Furthermore, adding Co&C can reduce the thickness of the intermetallic compounds (IMCs) and transform the scalloped IMCs into a planar shape. Reflowed for 2100 s, the IMCs at the Sn-0.7Cu-0.08Co&C/Cu interface maintain a planar shape, and their thickness is reduced by 21.10% compared with that of the Sn-0.7Cu/Cu interface. The synergistic effect between Co and carbon in Co&C jointly controls the interface reaction and the growth of IMCs.

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Recent advances on SnBi low-temperature solder for electronic interconnections

Cited by 43 publications

References 81 publications

Interfacial reaction of Sn-1.5Ag-2.0Zn low-silver lead-free solder with oriented copper

Interfacial reaction of Sn-1.5Ag-2.0Zn low-silver lead-free solder with oriented copper

Low-Temperature Soldering of Surface Mount Devices on Screen-Printed Silver Tracks on Fabrics for Flexible Textile Hybrid Electronics

Effects of Co Nanoparticles Embedded in Carbon Skeleton Nanosheet Addition to Sn-0.7Cu Solder on the Interfacial Reaction

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