2022
DOI: 10.3390/ma15031214
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Recent Advances on Thermoelectric Silicon for Low-Temperature Applications

Abstract: Silicon is the most widely used functional material, as it is geo-abundant and atoxic. Unfortunately, its efficiency as a thermoelectric material is very poor. In this paper, we present and discuss advances of research on silicon and related materials for thermoelectric applications, mostly focusing on the comparison between the two strategies deployed to increase its performance, namely either reducing its thermal conductivity or, in polycrystalline materials, increasing its power factor. Special attention wi… Show more

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Cited by 29 publications
(12 citation statements)
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References 98 publications
(106 reference statements)
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“…The conductivity of polycrystalline silicon is significantly influenced by the potential barrier, since the effective mobility of carriers is figured out by the potential barrier, as shown in Equations (1) and (2) [ 11 , 12 , 13 , 14 , 15 , 16 ]. …”
Section: Discussionmentioning
confidence: 99%
“…The conductivity of polycrystalline silicon is significantly influenced by the potential barrier, since the effective mobility of carriers is figured out by the potential barrier, as shown in Equations (1) and (2) [ 11 , 12 , 13 , 14 , 15 , 16 ]. …”
Section: Discussionmentioning
confidence: 99%
“…Figure 1a presents the method used for the measurement of S = ΔV/ΔT. Semiconductor materials are extensively studied [15][16][17][18] , as a same semiconductor can be used as n-type or p-type TE material depending on doping, and they allow substantial band engineering. However, interest of spin effects on material TE properties is growing, and investigations on magnetic material potential for TE applications has considerably raised.…”
Section: Magnetic Moment Impact On Spin-dependent Seebeck Coefficient...mentioning
confidence: 99%
“…1,2 As is known, single-crystalline bulk Si is a poorly performing thermoelectric material. 3 Despite its high power factor (4.5 mW m −1 K −2 at the optimal doping of 10 19 cm −3 ), its high thermal conductivity κ ≈ 140 W m −1 K −1 at room temperature dramatically reduces its thermoelectric figure of merit to about 0.01 at 300 K. 4 One possible way to reduce κ without affecting the Si Seebeck coefficient α and electrical conductivity σ is through the formation of dimensionally constrained nanostructures (NSs). 1 Si NWs with diameters smaller than the phonon mean-free path reported κ < 5 W m −1 K −11,2 due to phonon scattering at NW walls.…”
Section: ■ Introductionmentioning
confidence: 99%