Recent Developments in Electroless Plating

Boose, C.A.

doi:10.1080/00202967.1975.11870338

Cited by 10 publications

(1 citation statement)

References 3 publications

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“…This metallization is generally performed by applying conductive pastes on the surface. An alternative approach is a wet process which involves cleaning, etching, catalytic activation and electroless plating [3][4][5][6].…”

Section: -Introductionmentioning

confidence: 99%

A new fabrication technique of planar metallic microstructures on alumina substrate

Costa¹,

Flacker

Fruett

2009

ECS Trans.

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This paper describes a new fabrication technique of planar metallic microstructures with geometries equal or smaller than 15m on 96% alumina substrates. This technique is based on both: chemical and electrolytic deposition. In order to evaluate this technique we design and fabricate a bridge of interdigited capacitors. The microscope inspection showed that the structures well reproduced the design of the masks. The adhesion of the film was tested by soldering metallic wires on the capacitor electrodes. The mean value and the standard deviation considering 16 capacitors with distance between interdigited electrodes of 15μm, fabricated in two runs, are 1,484pF and 0,053pF, respectively. The relative standard deviation amounts to 3,3%.

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Section: -Introductionmentioning

confidence: 99%

A new fabrication technique of planar metallic microstructures on alumina substrate

Costa¹,

Flacker

Fruett

2009

ECS Trans.

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Characterization and microhardness of Co−W coatings electrodeposited at different pH using gluconate bath: A comparative study

Bera

Seenivasan

Rajam

et al. 2013

Surface & Interface Analysis

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Electrodeposition of Co–W alloy coatings has been carried out with DC and PC using gluconate bath at different pH. These coatings are characterized for their structure, morphology and chemical composition by X‐ray diffraction, field emission scanning electron microscopy, differential scanning calorimetry and X‐ray photoelectron spectroscopy (XPS). Alloy coatings plated at pH8 are crystalline, whereas coatings electrodeposited at pH5 are nanocrystalline in nature. XPS studies have demonstrated that as‐deposited alloy plated at pH8 with DC contain only Co2+ and W6+ species, whereas that alloy plated at pH5 has significant amount of Co0 and W0 along with Co2+ and W6+ species. Again, Co2+ and W6+ are main species in all as‐deposited PC plated alloys in both pH. Co0 concentration increases upon successive sputtering of all alloy coatings. In contrast, mainly W6+ species is detected in the following layers of all alloys plated with PC. Alloys plated at pH5 show higher microhardness compared to their pH8 counterparts. Copyright © 2013 John Wiley & Sons, Ltd.

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