Recent progress of Sn–Ag–Cu lead-free solders bearing alloy elements and nanoparticles in electronic packaging

Wang, Jie; Xue, Songbai; Wang, Jingwen; Liu, Shuang; Han, Yilong; Wang, Liujue

doi:10.1007/s10854-016-5407-3

Cited by 32 publications

(5 citation statements)

References 143 publications

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“…The cyclic temperature changes caused solder ball to experience thermal fatigue. This fatigue led to the deformation of the solder ball which occurred due to creep [12,13]. The result indicates that the solder ball in the BGA package is thermally stable at 500 cycles of TCT.…”

Section: Resultsmentioning

confidence: 99%

Thermal cycling effect on the crack formation of solder joint in ball grid array package

Suhaimi

Bakar

Jalar

et al. 2022

J. Phys.: Conf. Ser.

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Ball grid array (BGA) technology is one of the technologies used in surface mount technology (SMT). It provides many interconnection points via the solder ball and thus give advantages such as good heat dissipation, improved the PCB design, BGA package become robust and reliable. In electronic industry, the reliability of BGA package is being concerned. Thermal cycling test (TCT)is one of typical reliability test used to investigate the reliability of the BGA package. This study investigates on the thermal cycling effect on the crack formation of solder joint in ball grid array package. The BGA package was subjected to thermal cycle test with temperature cyclic of -40°C and 85°C for 500, 750 and 1000 cycles. The finding shows that the cracks were observed in solder joint in 750 and 1000 cycles. This shows that the BGA package is sensitive to the thermal cycling and effect its reliability. The package was modified with adding underfill materials and tested through the same cycles. Cross sectional and Dye and pry test show no crack formation and dye penetration for all thermal cycles in the BGA package with underfill.

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Section: Resultsmentioning

confidence: 99%

Thermal cycling effect on the crack formation of solder joint in ball grid array package

Suhaimi

Bakar

Jalar

et al. 2022

J. Phys.: Conf. Ser.

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“…The reinforcements are usually nano-particles (NPs) (mostly nanopowders, sometimes nano-fibers) and applied in 0.1-1 wt%. A wide range of oxide ceramics was tried in composite solder joints: A l 2 O 3 , SiC, ZnO, TiO 2 , ZrO 2 , Si 3 Ni 4 , L a 2 O 3 , etc [2].…”

Section: Introductionmentioning

confidence: 99%

Comparing the Solderability of Different SA C0307 Composite Solder Pastes

Illés,

Choi,

Skwarek

2024

IMAPSource Proceedings

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In the present study, the effect of four oxide ceramics (TiO2, ZnO, ZrO2, and CuO) as reinforcements were investigated on the soldering parameters of the SAC 0307 solder alloy. The oxide ceramics were used in nano-powder format. Composite solder pastes were composed by the standard ball milling process of the nano-particles into the SAC 0307 solder paste in 0.25wt% weight fraction. The wettability, shear strength, and microstructure of the composite solder joints were studied and compared. The ceramic nano-particles did not have a major effect on the wettability of the solder. Shear strength increases were observed at the composite joints, except in the case of ZnO. Generally, Sn grain refinement was found in the Sn-matrix which could be the reason for the shear strength increase.

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“…Owing to environmental consequences (toxicity of Pb), thus, it contributed to a ban on electronics products in majority of countries. The use of harmful substances in electronic products have been prohibited by the European Union's Restriction of Hazardous Substances (RoHS) in 2006 [1,7]. As a result of the lead restriction in the electronic industry, there has been an increasing number of lead-free solders been investigated and developed to replace them [8,9].…”

Section: Introductionmentioning

confidence: 99%

Influence of TiO2 and Al2O3 Nanoparticles Addition on Thermal, Wettability and IMC Growth of Sn-3.0Ag-0.5Cu Lead-Free Solder at Different Reflow Temperature

Nur Haslinda Mohamed Muzni,

Ervina Efzan Mhd Noor,

Mohd Mustafa Al-Bakri Abdullah

2023

ARFMTS

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This study investigated the influence of adding 0.50 wt% and 1.0 wt% titanium dioxide (TiO2) and aluminium oxide (Al2O3) nanoparticles on the properties of Sn3.0Ag0.5Cu (SAC305) lead-free solder alloy. In terms of thermal properties, SAC305 lead-free solder with or without addition of TiO2 and Al2O3 nanoparticles, the melting temperature is very similar and comparable. The wetting performance of the SAC305 nanocomposite solder was determined by the contact angle. The best contact angle recorded is 31.65° at reflow temperature of 250°C for 0.50 wt% addition of TiO2 and Al2O3 nanoparticles. The thickness of the IMC layer was observed using an Optical Microscope and measured. Results show that the thickness of the IMC layer decreased when TiO2 and Al2O3 nanoparticles were reinforced into the SAC305 solder system, which shows significant decrease when 0.50wt% of TiO2 and Al2O3 nanoparticles were added. However, beyond 0.50 wt% the thickness of IMC layer increases along with increasing reflow temperature. The results reveal that the adsorption effect of TiO2 and Al2O3 nanoparticles will restrict the growth of the IMC layer under controlled concentration of the nanoparticles and reflow temperature. The optimal parameters to enhance the performance of SAC305 solder by reinforcing TiO2 and Al2O3 nanoparticles are reflowed at 250°C at 0.50 wt% concentration of TiO2 and Al2O3 nanoparticles.

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Recent progress of Sn–Ag–Cu lead-free solders bearing alloy elements and nanoparticles in electronic packaging

Cited by 32 publications

References 143 publications

Thermal cycling effect on the crack formation of solder joint in ball grid array package

Thermal cycling effect on the crack formation of solder joint in ball grid array package

Comparing the Solderability of Different SA C0307 Composite Solder Pastes

Influence of TiO2 and Al2O3 Nanoparticles Addition on Thermal, Wettability and IMC Growth of Sn-3.0Ag-0.5Cu Lead-Free Solder at Different Reflow Temperature

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