Recent progresses on hybrid micro–nano filler systems for electrically conductive adhesives (ECAs) applications

Amoli, Behnam Meschi; Hu, Anming; Zhou, Norman Y.; Zhao, Boxin

doi:10.1007/s10854-015-3016-1

Cited by 46 publications

(16 citation statements)

References 77 publications

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“…Sintered Ag adhesive is an adhesive with nanofillers such as nano-Ag particles and a polymeric matrix to provide the adhesion to eliminate the preheating or solvent drying step and pressure during sintering. However, the use of polymeric matrix would slightly compromise the electrical performance of this adhesive Ag joint because of their lower sintering temperature at less than 200 C [47].…”

Section: Formulation Of Ag Pastesmentioning

confidence: 99%

Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study

Siow

Lin

2016

Journal of Electronic Packaging

122

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Sintered silver joint is a porous silver that bonds a semiconductor die to the substrate as part of the packaging process. Sintered Ag is one of the few possible bonding methods to fulfill the operating conditions of wide band-gap (WBG) power device technologies. We review the current technology development of sintered Ag as a bonding material from the perspective of patents filed by various stakeholders since late 1980s. This review addresses the formulation of sintered pastes (i.e., nano-Ag, hybrid Ag, and micron Ag fillers), innovations in the process and equipment to form this Ag joint. This review will provide the insights and confidence to engineers, scientists from universities and industry as well as investors who are developing and commercializing the sintered Ag as a bonding material for microelectronic packaging.

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Section: Formulation Of Ag Pastesmentioning

confidence: 99%

Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study

Siow

Lin

2016

Journal of Electronic Packaging

122

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“…In Ag NP/Ag NW electrodes, fillers were bonded through metallic bonds. However, the connections between carbon and silver were mainly by van der Waals bonds, which results in a lower interface bonding strength [42]. As shown in Figure 7a, in printed pure Ag NP electrode after bending test, Ag was still connected due to its good ductility.…”

Section: Resultsmentioning

confidence: 99%

Electrical and Mechanical Properties of Ink Printed Composite Electrodes on Plastic Substrates

et al. 2018

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Printed flexible electrodes with conductive inks have attracted much attention in wearable electronics, flexible displays, radio-frequency identification, etc. Conventional conductive inks contain large amount of polymer which would increase the electrical resistivity of as-printed electrodes and require high sintering temperature. Here, composite electrodes without cracks were printed on polyimide substrate using binder-free silver nanoparticle based inks with zero-dimensional (activated carbon), one-dimensional (silver nanowire and carbon nanotube) or two-dimensional (graphene) fillers. The effect of fillers on resistivity and flexibility of printed composite electrodes were evaluated. The graphene filler could reduce the resistivity of electrodes, reaching 1.7 × 10−7 Ω·m after low power laser sintering, while the silver nanowire filler improved their flexibility largely during bending tests. The microstructural changes were examined to understand the nanojoining process and their properties.

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“…[94] The formation of these electron transfer paths eventually leads to an insulator-to-conductor transition, which causes the whole material to become conductive, and the critical value of this phase transition first occurs is characterized as percolation threshold. [97] To date, only few studies have employed percolation mechanism to investigate the electrical conductivity of ECHs. One example is reported by Panhuis et al, who revealed that the percolation threshold for CNTs in a gellan gum hydrogel was 1.3% by weight concentration, and the electrical conductivity at this point was observed to be approximately 10 -2 S/cm.…”

Section: Percolation Theory In Electrically Conductive Hydrogelsmentioning

confidence: 99%

Electrically conductive hydrogels for flexible energy storage systems

Zhang

Pan

Chen

et al. 2019

Progress in Polymer Science

Self Cite

323

169

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Electrically conductive hydrogels (ECHs), combining electrical properties of metals or semiconductors with the unique features of hydrogels, are ideal frameworks to design and construct flexible supercapacitors and batteries. This review summarized the material design and synthetic approach of ECHs, demonstrating the advances of percolation theory in ECH materials, followed by presenting their effective application in flexible energy storage systems, and discussed the challenges and opportunities in this field.

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Recent progresses on hybrid micro–nano filler systems for electrically conductive adhesives (ECAs) applications

Cited by 46 publications

References 77 publications

Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study

Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study

Electrical and Mechanical Properties of Ink Printed Composite Electrodes on Plastic Substrates

Electrically conductive hydrogels for flexible energy storage systems

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