Recrystallization behavior of lead free and lead containing solder in cycling

Qasaimeh, Awni; Jaradat, Younis; Wentlent, Luke; Yang, Linlin; Yin, Liang; Arfaei, Babak; Børgesen, Peter

doi:10.1109/ectc.2011.5898753

Cited by 14 publications

(3 citation statements)

References 10 publications

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“…Failure in thermal cycling is controlled by global recrystallization followed by crack propagation along the new network of grain boundaries [17] and the damage rate appears to scale with the rate of work during the high temperature dwell alone [5]. In contrast, damage in isothermal cycling occurs by transgranular crack growth [18]- [22].…”

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confidence: 99%

Correlation Between Solder Joint Fatigue Life and Accumulated Work in Isothermal Cycling

Hamasha

Qasaimeh

Jaradat

et al. 2015

IEEE Trans. Compon., Packag. Manufact. Technol.

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The fatigue behavior of solder joints in realistic service applications is still not well understood. Service life prediction based on conducting accelerated tests and extrapolating test results therefore involves a high potential for error. Understanding both the evolution of solder joint properties and the damage accumulation has proved to be critical to reliability modeling. Damage accumulation in isothermal cycling is shown to scale with the accumulated inelastic work even in complex cycling scenarios, so that the life of a solder joint ends upon accumulation of a given amount of work. Individual ball grid array solder joints were cycled in shear fatigue experiments with different load amplitudes and strain rates. The effects of load amplitudes and strain rates on the work accumulation and fatigue life were systematically addressed. The correlation between different loading scenarios and the accumulated work to failure was also discussed. The results showed that the accumulated work until the development of a major crack is constant regardless of the load amplitude. After that the accumulated work to failure is lower for larger load amplitudes. For some reason, a larger fraction of the work appears to be dissipating as heat at lower load amplitude, but only during crack growth. On the other hand, the strain rate affects the fraction of the work going to heat even before the development of a major crack.

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confidence: 99%

Correlation Between Solder Joint Fatigue Life and Accumulated Work in Isothermal Cycling

Hamasha

Qasaimeh

Jaradat

et al. 2015

IEEE Trans. Compon., Packag. Manufact. Technol.

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“…Figure 7 shows the result of this for 1.4 mm pitch components. Cracks are seen to initiate early but grow relatively slowly for more than 20% of the life, corresponding to the formation of a recrystallized region across the joint [8,12]. Limaye et al [2] did not detect any cracks until after 5% of the total solder joint life.…”

Section: Crack Measurementsmentioning

confidence: 99%

Crack evolution and rapid life assessment for lead free solder joints

Qasaimeh

Børgesen

2011

2011 IEEE 61st Electronic Components and Technology Conference (ECTC)

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This paper reports on the crack behavior and microstructure evolution of lead free solder joints during thermal and isothermal fatigue testing. Daisy chained Ball Grid Array (BGA) assemblies were subjected to either accelerated thermal cycling or cyclic bending at room temperature. In the case of thermal cycling effects of strain range were assessed by comparing assemblies with different distances to neutral point. Crack areas were measured by dye and pry and recrystallization detected by optical microscopy with crossed polarizers. The stochastic nature of the fatigue crack growth associated with variations in Sn grain orientation was addressed by using pattern recognition with Artificial Neural Network (ANN). Different statistics were calculated for the different crack curves at specific life percentages to address the change in crack growth distributions at these different live intervals.

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“…), versus time and temperature in cycling. [15][16][17][18][19] The results are combined with a damage function to predict the ongoing evolution of damage and failure. Our overall work is focused on this kind of approach.…”

Section: Introductionmentioning

confidence: 99%

A Mechanistic Thermal Fatigue Model for SnAgCu Solder Joints

Børgesen

Wentlent

Hamasha

et al. 2018

Journal of Elec Materi

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The present work offers both a complete, quantitative model and a conservative acceleration factor expression for the life span of SnAgCu solder joints in thermal cycling. A broad range of thermal cycling experiments, conducted over many years, has revealed a series of systematic trends that are not compatible with common damage functions or constitutive relations. Complementary mechanical testing and systematic studies of the evolution of the microstructure and damage have led to a fundamental understanding of the progression of thermal fatigue and failure. A special experiment was developed to allow the effective deconstruction of conventional thermal cycling experiments and the finalization of our model. According to this model, the evolution of damage and failure in thermal cycling is controlled by a continuous recrystallization process which is dominated by the coalescence and rotation of dislocation cell structures continuously added to during the hightemperature dwell. The dominance of this dynamic recrystallization contribution is not consistent with the common assumption of a correlation between the number of cycles to failure and the total work done on the solder joint in question in each cycle. It is, however, consistent with an apparent dependence on the work done during the high-temperature dwell. Importantly, the onset of this recrystallization is delayed by pinning on the Ag 3 Sn precipitates until these have coarsened sufficiently, leading to a model with two terms where one tends to dominate in service and the other in accelerated thermal cycling tests. Accumulation of damage under realistic service conditions with varying dwell temperatures and times is also addressed.

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Recrystallization behavior of lead free and lead containing solder in cycling

Abstract: The present work addresses the effects of thermomechanical history on the recrystallization behavior of lead free and backward compatible solder joints. 30 mil SAC305 balls were reflowed onto BGA pads using either a SAC305 or a eutectic SnPb paste.

Cited by 14 publications

References 10 publications

Correlation Between Solder Joint Fatigue Life and Accumulated Work in Isothermal Cycling

Correlation Between Solder Joint Fatigue Life and Accumulated Work in Isothermal Cycling

Crack evolution and rapid life assessment for lead free solder joints

A Mechanistic Thermal Fatigue Model for SnAgCu Solder Joints

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