Rectangular waveguide-to-coplanar waveguide transitions at U-band using e-plane probe and wire bonding

Abstract

This paper presents rectangular waveguide-tocoplanar waveguide (CPW) transitions at U-band (40 -60 GHz) using E-plane probe and wire bonding. The designs of CPWs based on quartz substrate with and without aluminum cover are explained. The single and double layer rectangular waveguideto-CPW transitions using E-plane probe and wire bonding are designed. The proposed rectangular waveguide-to-CPW transition using wire bonding can provide 10 GHz bandwidth at Uband and does not require extra CPWs or connections between CPWs and chips. A single layer rectangular waveguide-to-CPW transition using E-plane probe with aluminum package has been fabricated and measured to validate the proposed transitions. To the authors' best knowledge, this is the first time that a wire bonding is used as a probe for rectangular waveguide-to-CPW transition at U-band.

System Integration and Packaging of a Terahertz Photodetector at $W$ -Band

“…Since both the feeding network and the bias-tee are based on CPWs, the transition becomes an essential component in the packaging structure. Several different types of rectangular waveguide-to-CPW transitions can be found in the literature [20]- [25] while E-plane probe exhibits noticeable performances especially at millimeter-wave and submillimeter-wave frequencies [26]- [29]. Fig.…”

A D-Band Rectangular Waveguide-to-Coplanar Waveguide Transition Using Wire Bonding Probe

“…In order to validate the concept, a rectangular waveguide-to-CPW transition using wire bonding probe was preliminarily designed at U-band (40-60 GHz) and its design details as well as simulation results were reported in [20]. Fig.…”

“…Coplanar waveguide (CPW) and microstrip are two types of planar transmission lines commonly used for designing high frequency chips. Due to the need for system packaging, the transitions between rectangular waveguides and planar transmission lines are under intensive study [4]- [20]. The challenging requirements for such transitions are wideband operation with low insertion loss and at the same time being versatile and compact for packaging the existing components and chips.…”

On-chip patch antenna on InP substrate for short-range wireless communication at 140 GHz

“…The chipto-waveguide transition in back-to-back configuration exhibits a simulated return loss of 10 dB and insertion loss of 3 dB from 128 GHz to 153 GHz which covers the transmission frequency band and proves the wideband matching behavior of the optimized on-chip patch antenna. Besides on-chip antenna, E-plane probe and wire bonding can also be used for chip-towaveguide transitions [4].…”