2024
DOI: 10.1007/s13233-024-00276-4
|View full text |Cite
|
Sign up to set email alerts
|

Reduced interfacial thermal resistance in acidic alumina-filled adhesives for heat dissipative applications

Dong-In Shin,
Jisung Lee,
Chanseul Kim
et al.
Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...

Citation Types

0
0
0

Year Published

2024
2024
2024
2024

Publication Types

Select...
1

Relationship

0
1

Authors

Journals

citations
Cited by 1 publication
references
References 40 publications
0
0
0
Order By: Relevance