Reducing EMC problems through an electrical/optical interconnection technology

Griese, Elmar

doi:10.1109/15.809854

Cited by 27 publications

(7 citation statements)

References 5 publications

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“…Unter BerL~cksich-tigung der stetig steigenden Anforderungen an die Daten0ber-tragungsraten sind in absehbarer Zukunft auch optische Verbindungen auf Leiterplatten erforderlich. Dieses bedeutet, dass neben den Herstellungstechnologien und -prozessen for die resultierenden elektrisch-optischen Leiterplatten auch durchg&ngige LSsungen und Prozesse for deren Entwurf unter industriellen Randbedingungen verf0gbar sein m0ssen (Griese, 1999).…”

Section: Finleit"nlunclassified

Modellierungs- und Simulationsverfahren für die optische Verbindungstechnik auf elektrischen Leiterplatten

Griese

2003

Elektrotech. Inftech.

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Section: Finleit"nlunclassified

Modellierungs- und Simulationsverfahren für die optische Verbindungstechnik auf elektrischen Leiterplatten

Griese

2003

Elektrotech. Inftech.

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“…The potential for high data rate, for miniaturization, and the promise of immunity against interference suggests to integrate optical interconnects onto printed circuit boards (PCBs) [1]. Under certain conditions even the power consumption can be lower compared to electrical connections [2].…”

Section: Introductionmentioning

confidence: 99%

Experimental demonstration of the robustness against interference of optical interconnects on printed circuit boards

Schmid

Leeb

Langer

2010

2010 IEEE Photonics Society Winter Topicals Meeting Series (WTM)

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“…Since these problems only arise during transduction (electronics-to-optics or opticsto-electronics), the purely optical part and optical link(interconnection) is free of these problems. 1 An optical link system constructed with TRx modules was fabricated and the optical characteristics about data links and EMI levels were measured. The results clearly demonstrate that the use of an optical wiring method can provide robust and cost-effective assembly for reducing EMI of inter-chip interconnect.…”

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Optical link by using optical wiring method for reducing EMI

et al. 2008

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A practical optical link system was prepared with a transmitter (Tx) and receiver (Rx) for reducing EMI (electromagnetic interference). The optical TRx module consisted of a metal optical bench, a module printed circuit board (PCB), a driver/receiver IC, a VCSEL/PD array, and an optical link block composed of plastic optical fiber (POF). For the optical interconnection between the light-sources and detectors, an optical wiring method has been proposed to enable easy assembly. The key benefit of fiber optic link is the absence of electromagnetic interference (EMI) noise creation and susceptibility.This paper provides a method for optical interconnection between an optical Tx and an optical Rx, comprising the following steps: (ⅰ) forming a light source device, an optical detection device, and an optical transmission unit on a substrate (metal optical bench (MOB)); (ⅱ) preparing a flexible optical transmission-connection medium (optical wiring link) to optically connect the light source device formed on the substrate with the optical detection device; and (ⅲ) directly connecting one end of the surface-finished optical transmission connection medium with the light source device and the other end with the optical detection device. Electronic interconnections have uniquely electronic problems such as EMI, shorting, and ground loops. Since these problems only arise during transduction (electronics-to-optics or opticsto-electronics), the purely optical part and optical link(interconnection) is free of these problems. 1 An optical link system constructed with TRx modules was fabricated and the optical characteristics about data links and EMI levels were measured. The results clearly demonstrate that the use of an optical wiring method can provide robust and cost-effective assembly for reducing EMI of inter-chip interconnect. We successfully achieved a 4.5 Gb/s data transmission rate without EMI problems.

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Reducing EMC problems through an electrical/optical interconnection technology

Cited by 27 publications

References 5 publications

Modellierungs- und Simulationsverfahren für die optische Verbindungstechnik auf elektrischen Leiterplatten

Modellierungs- und Simulationsverfahren für die optische Verbindungstechnik auf elektrischen Leiterplatten

Experimental demonstration of the robustness against interference of optical interconnects on printed circuit boards

Optical link by using optical wiring method for reducing EMI

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