Reduction in Mechanical Strength of Copper by the Presence of a Thin Epitaxial Overgrowth of Nickel

Abstract

Deformation mechanisms and strength in nanoscale multilayer metallic composites with coherent and incoherent interfaces Appl. Phys. Lett. 94, 173114 (2009); 10.1063/1.3129166 Critical thickness of equilibrium epitaxial thin films using finite element method J. Appl. Phys. 95, 8472 (2004); 10.1063/1.1745115 Effect of reaction time and P content on mechanical strength of the interface formed between eutectic Sn-Ag solder and Au/electroless Ni(P)/Cu bond pad Dependence of the coercive field on the Cu overlayer thickness in thin Co/Cu(001) and Ni/Cu(001) fcc epitaxial films

Surface film effects during cyclic deformation of dislocation-mobility-limited materials

“…Consequently, surface film softening in <001> dislocation-containing materials is thought to occur from a general dislocation pumping process occurring at the film-substrate interface, which results in an effective increase in the overall mobile dislocation density available to effect plastic flow. Such results are analogous to reduced flow stresses observed by Ruddle and Wilsdorf for nickel-plated single crystals of copper many years ago (19).…”