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Deformation mechanisms and strength in nanoscale multilayer metallic composites with coherent and incoherent interfaces Appl. Phys. Lett. 94, 173114 (2009); 10.1063/1.3129166 Critical thickness of equilibrium epitaxial thin films using finite element method J. Appl. Phys. 95, 8472 (2004); 10.1063/1.1745115 Effect of reaction time and P content on mechanical strength of the interface formed between eutectic Sn-Ag solder and Au/electroless Ni(P)/Cu bond pad Dependence of the coercive field on the Cu overlayer thickness in thin Co/Cu(001) and Ni/Cu(001) fcc epitaxial films