Reduction of PFC emissions to the environment through advances in CVD and etch processes

Johnson, Andrew; Ridgeway, Robert G.; Maroulis, Peter J.

doi:10.1109/tsm.2004.835700

Cited by 9 publications

(4 citation statements)

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“…The electron scattering by polyatomic molecular targets in gas phase has been of interest for a range of applications, since electrons drive reactions in gaseous media in plasmas, astrophysical environments, planetary atmospheres. In the case of a polyfluorocarbon compound (PFC), gases such as CF 4 , C 2 F 6 , C 3 F 8 , CHF 3 , SF 6 , and NF 3 have been used for etching of dielectric materials including SiO 2 and Si 3 N 4 and removing the dielectric materials from chemical vapor deposition reactors [1][2][3][4][5]. The role of these molecules in the environment is also important, since their presence in the atmosphere expedites the effects of global warming because of their long atmospheric lifespan, large global warming potential (GWP100) over a 100 years' horizon, and strong infrared absorption.…”

Section: Introductionmentioning

confidence: 99%

Low energy elastic scattering of electrons from hexafluoropropene (C₃F₆)

Sakaamini¹,

Hlousek²,

Khakoo³

et al. 2018

J. Phys. B: At. Mol. Opt. Phys.

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We present cross sections from a joint experimental and theoretical study on elastic electron scattering from hexafluoropropene (C3F6) in the gas phase. The experimental results, using low energy electron spectroscopy, were obtained at incident electron energies of 0.5, 1, 1.5, 2, 3, 4, 5, 6, 10, 12, 15 and 20 eV, for scattering angles ranging from 10° to 130°. The theoretical method used in the computation of the integral, momentum transfer and differential cross sections (DCSs) is the Schwinger multichannel method with pseudopotentials. The cross sections were computed in the static-exchange and static-exchange plus polarization approximations for energies up to 20 eV. In general, the present experimental and calculated DCSs agree well among each other, except at 3 eV. Our results also agree well with previous measurements available at 2, 5 and 8 eV. The calculated integral and momentum transfer cross sections display a series of resonances, where the low-lying resonance has a π* character and is located at around 1 eV. This resonance was also observed in previous total cross section measurements at around 1.2 eV (Makochekanwa et al 2005 Eur. Phys. J. D 35 249).

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Section: Introductionmentioning

confidence: 99%

Low energy elastic scattering of electrons from hexafluoropropene (C₃F₆)

Sakaamini¹,

Hlousek²,

Khakoo³

et al. 2018

J. Phys. B: At. Mol. Opt. Phys.

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“…One can expect to prevent failure by cross-contamination from imperfect chamber cleaning. Fourier transform infrared (FTIR) was used to optimize the type and usage of cleaning gases in CVD for manufacturing cost reduction [4], and multi-sensor study on reducing PFC gas emission in CVD chamber cleaning has been performed employing quadrupole mass spectrometry (QMS) [5]. FTIR and QMS can provide benefits of monitoring chamber residual gases from exhaust, but they require additional set up for real-time data acquisition.…”

Section: Introductionmentioning

confidence: 99%

PECVD Chamber Cleaning End Point Detection (EPD) Using Optical Emission Spectroscopy Data

Lee¹,

Seo²,

Hong

et al. 2013

Transactions on Electrical and Electronic Materials

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In-situ optical emission spectroscopy (OES) is employed for PECVD chamber monitoring. OES is used as an addon sensor to monitoring and cleaning end point detection (EPD). On monitoring plasma chemistry using OES, the process gas and by-product gas are simultaneously monitored. Principal component analysis (PCA) enhances the capability of end point detection using OES data. Through chamber cleaning monitoring using OES, cleaning time is reduced by 53%, in general. Therefore, the gas usage of fluorine is also reduced, so satisfying Green Fab challenge in semiconductor manufacturing.

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“…The cumulative ion flux from successive cleans damaged the chamber surfaces, necessitating periodic maintenance. An additional concern about these in situ cleans is their inefficient use of the PFCs; about 30% [1]; i.e. approximately 70% of the influent PFCs are emitted from the process tool.…”

Section: Introductionmentioning

confidence: 99%

Production and transport chemistry of atomic fluorine in remote plasma source and cylindrical reaction chamber

Gangoli¹,

Johnson²,

Fridman³

et al. 2007

J. Phys. D: Appl. Phys.

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Increasingly, NF3-based plasmas are being used in semiconductor manufacturing to clean chemical vapour deposition (CVD) chambers. With advantages such as faster clean times, substantially lower emissions of gases having high global warming potentials, and reduced chamber damage, NF3 plasmas are now favoured over fluorocarbon-based processes. Typically, a remote plasma source (RPS) is used to dissociate the NF3 gas and produce atomic fluorine that etches the CVD residues from the chamber surfaces. However, it is important to efficiently transport F atoms from the plasma source into the process chamber. The current work is aimed at understanding and improving the key processes involved in the production and transport of atomic fluorine atoms. A zero-dimensional model of NF3 dissociation and F production chemistry in the RPS is developed based on various known and derived plasma parameters. Additionally, a model describing the transport of atomic fluorine is proposed that includes both physical (diffusion, adsorption and desorption) and chemical processes (surface and three-body volume recombination). The kinetic model provides an understanding of the impact of chamber geometry, gas flow rates, pressure and temperature on fluorine recombination. The plasma-kinetic model is validated by comparing model predictions (percentage F atom density) with experimental results (etch rates).

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Reduction of PFC emissions to the environment through advances in CVD and etch processes

Cited by 9 publications

References 1 publication

Low energy elastic scattering of electrons from hexafluoropropene (C₃F₆)

Low energy elastic scattering of electrons from hexafluoropropene (C₃F₆)

PECVD Chamber Cleaning End Point Detection (EPD) Using Optical Emission Spectroscopy Data

Production and transport chemistry of atomic fluorine in remote plasma source and cylindrical reaction chamber

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Reduction of PFC emissions to the environment through advances in CVD and etch processes

Cited by 9 publications

References 1 publication

Low energy elastic scattering of electrons from hexafluoropropene (C3F6)

Low energy elastic scattering of electrons from hexafluoropropene (C3F6)

PECVD Chamber Cleaning End Point Detection (EPD) Using Optical Emission Spectroscopy Data

Production and transport chemistry of atomic fluorine in remote plasma source and cylindrical reaction chamber

Contact Info

Product

Resources

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Low energy elastic scattering of electrons from hexafluoropropene (C₃F₆)

Low energy elastic scattering of electrons from hexafluoropropene (C₃F₆)