2002
DOI: 10.1002/1521-3951(200212)234:3<840::aid-pssb840>3.0.co;2-k
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Reduction of Planar Defect Density in Laterally Overgrown Cubic-GaN on Patterned GaAs(001) Substrates by MOVPE

Abstract: The metalorganic vapor phase epitaxy (MOVPE) growth of cubic-GaN (c-GaN) layers has been preformed on the [1 1 10]-stripe patterned GaAs (001) substrates. The surface morphology of the laterally overgrown layer was much improved with the formation of the flat (311)A surfaces as the growth proceeded. It is shown that the c-GaN layer thicker than 20 mm was grown on GaAs(001) substrates with the stripe direction in [1 1 10] for 90 min. Microstructure and extended defect distribution in the laterally overgrown c-G… Show more

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Cited by 12 publications
(17 citation statements)
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“…In order to achieve smooth and flat GaN surface and GaN/GaAs interface, several growth processes must be adequately controlled [27]. These processes include prevention of GaAs decomposition and minimizing of dislocations density that can lead to improvement of GaN crystal quality [28,29]. It is well known that, due to As element loss, uncapped GaAs decomposes when it is heated at temperature above 600°C.…”
Section: Introductionmentioning
confidence: 99%
“…In order to achieve smooth and flat GaN surface and GaN/GaAs interface, several growth processes must be adequately controlled [27]. These processes include prevention of GaAs decomposition and minimizing of dislocations density that can lead to improvement of GaN crystal quality [28,29]. It is well known that, due to As element loss, uncapped GaAs decomposes when it is heated at temperature above 600°C.…”
Section: Introductionmentioning
confidence: 99%
“…It is known that for c‐GaN grown films, hexagonal phase inclusion with cubic true(111true)// and hexagonal true(0002true) crystal orientation is probably incorporated as planar defects, including stacking faults (SFs) and twins. Because the diffraction pattern is related to these planar defects, which are typical defects observed in the meta‐stable phase c‐GaN , a large tilting from the true(002true) plane is exhibited. To verify the formation of the hexagonal phase inclusion in the ELOG c‐GaN films, the X‐ray RSMs were thus performed with the incident X‐ray beams both perpendicular and parallel to the true[110true] mask‐stripe direction.…”
Section: Resultsmentioning
confidence: 99%
“…These results show that the high cubic-phase purity of a c-GaN film can be achieved by using the ELOG via MOVPE with the mask-stripe direction aligned along the 110 ½ direction. As a result, this demonstrates the ability to control the structural phase transformation between cubic and hexagonal phases in the ELOG c-GaN stripes, even given the appearance of the 111 ð ÞB sidewalls [15]. It is known that the hexagonal phase inclusion is easily constructed on the 111 ð ÞB surfaces compared to that on the 111 ð ÞA [17] and 311 ð ÞA [13,15] surfaces.…”
mentioning
confidence: 88%
“…In the growth of c-III-N films, however, the major issue is the undesired inclusion of the hexagonal phase which degrades the whole film quality because of the metastable nature of the c-III-N. When a GaAs(001) substrate is used, it has been known that the hexagonal phase tends to be generated through stacking faults in such a way that [0001](hex)//[111](cubic) or equivalents on the {111} facets which happen to occur by thermal roughening of the substrate surface [1][2][3][4] , as illustrated in Figure 1. Thus, it is very essential to keep the initial flat surface at the beginning of the epitaxial growth on the cubic substrates.…”
Section: Introductionmentioning
confidence: 99%