Regeneration by Membrane Electrolysis of an Etching Solution Based on Copper Chloride

Turaev, D. Yu.; Kruglikov, S. S.; Parfenova, A. V.

doi:10.1007/s11167-005-0535-1

Cited by 4 publications

(3 citation statements)

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“…The mechanism proposed from the XRD data also involves cuprous oxide in addition to cuprous chloride. 37,38 In oxidizing (i.e. in the presence of oxygen in air or water) and acidic environments, paratacamite can form according to the mechanism below: The oxide layers of the copper may have promoted reactions with HCl that produced the copper chloride required to facilitate paratacamite formation.…”

Section: Chemical Routes For Paratacamite Formationmentioning

confidence: 99%

Formation of paratacamite nanomaterials via the conversion of aged and oxidized copper nanoparticles in hydrochloric acidic media

et al. 2011

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Section: Chemical Routes For Paratacamite Formationmentioning

confidence: 99%

Formation of paratacamite nanomaterials via the conversion of aged and oxidized copper nanoparticles in hydrochloric acidic media

et al. 2011

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“…[CuCl2] -complexes in rich Clsolution, and further form CuCl precipitate [29], as shown in Fig. 3c, the specific reaction equations are shown in Eqs.…”

Section: Resultsmentioning

confidence: 99%

Surface Texturing Behavior of Nano-copper Particles under Various Copper Salts System during Copper-assisted Chemical Etching

Hong¹,

Ma²,

Chen³

et al. 2021

Preprint

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In this work, the effects of different copper salts on the etching behavior of n-type monocrystalline silicon wafers were detailedly studied by Cu-assisted chemical etching method. Firstly, the inverted pyramid, inverted pyramid-like and oval pit texturing structures were obtained by HF/H2O2/Cu(NO3)2, HF/H2O2/CuSO4 and HF/H2O2/CuCl2 etching systems. Then, the evolution of copper particles deposition behavior was studied to reveal the influencing mechanism of different anion species, the textured wafer surfaces were characterized by scanning electron microscopy (SEM) and ultraviolet-visible (UV) spectrophotometer, the etching rate, silicon wafer thinning and the deposition amount of copper particle was systematically analyzed. We conclude that the binding force between anion and cation, the oxidation of anions and the formation of complex groups [CuCl2]− lead to great difference in the deposition behavior of copper, resulting in different etching morphology and etching rate. The moderate size copper particles deposited from HF/H2O2/Cu(NO3)2 system make that the etching process is mild and the anisotropic etching ability can fully demonstrated, and the regular inverted pyramid structures can be formed under low thinning of silicon wafers. This work will provide guidance for controllable preparation of inverted pyramid structure and future application in high efficiency solar cells.

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“…Therefore, processes involving the use of ion-exchange membranes separating the anode and cathode spaces of the electrolyzer have become widespread [14,15].…”

Section: Introductionmentioning

confidence: 99%

Perspective Method for Regeneration of Spent Solutions from Printed Circuit Boards Etching

Makovskaya

Shevchuk

Anikin

2020

MSF

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The process of copper regeneration from spent hydrochloric acid etching solution of printed circuit boards is considered. A combined scheme is proposed, which includes the preliminary removal of excess chlorine ions from the solution, using a highly basic anion exchange resin and the subsequent electrochemical precipitation of copper. A solution contents, g/dm3: 237 Cu, 27 NH4Cl, 11.6 HCl was used. Electrical extraction was performed at a current density of 650 A/m2. The method makes it possible to prevent the emission of chlorine at the anode and ensures the obtaining copper as metal.

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Regeneration by Membrane Electrolysis of an Etching Solution Based on Copper Chloride

Cited by 4 publications

References 0 publications

Formation of paratacamite nanomaterials via the conversion of aged and oxidized copper nanoparticles in hydrochloric acidic media

Formation of paratacamite nanomaterials via the conversion of aged and oxidized copper nanoparticles in hydrochloric acidic media

Surface Texturing Behavior of Nano-copper Particles under Various Copper Salts System during Copper-assisted Chemical Etching

Perspective Method for Regeneration of Spent Solutions from Printed Circuit Boards Etching

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