Reinforcements at nanometer length scale and the electrical resistivity of lead-free solders

Babaghorbani, P.; Nai, Mui Ling Sharon; Gupta, Manoj

doi:10.1016/j.jallcom.2008.11.074

Cited by 56 publications

(32 citation statements)

References 32 publications

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“…A similarly insignificant influence of metallic and ceramic nano-sized particles on the electrical resistivity of the solder Sn-3.5Ag and Sn-3.5Ag-0.7Cu matrix at ambient temperature was also found in Ref. [30]. The apparent increase in the electrical resistivity, observed for the alloy with 1 wt% Co addition, could be explained by microstructure changes related to an increase of Co-containing (Co,Cu)-Sn IMCs in the alloy.…”

Section: Effect Of Co Nanoparticles On the Electrical Resistivity Of supporting

confidence: 57%

Nanocomposite SAC solders: morphology, electrical and mechanical properties of Sn–3.8Ag–0.7Cu solders by adding Co nanoparticles

Yakymovych

Plevachuk

Švec

et al. 2017

J Mater Sci: Mater Electron

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Section: Effect Of Co Nanoparticles On the Electrical Resistivity Of supporting

confidence: 57%

Nanocomposite SAC solders: morphology, electrical and mechanical properties of Sn–3.8Ag–0.7Cu solders by adding Co nanoparticles

Yakymovych

Plevachuk

Švec

et al. 2017

J Mater Sci: Mater Electron

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“…It has been demonstrated by other reporters that the electrical performance mainly the resistivity of composite interconnect materials depends on the size, shape and volume percentages of reinforcing elements. It also influences the type of reinforcing elements and matrix phases [38]. Moreover, as the operating temperature increased from room temperature to 100°C, the electrical resistivity also increased in both types of interconnected solder alloys.…”

Section: Measurement Of Mechanical Properties Of Bulkmentioning

confidence: 99%

Interfacial microstructure, wettability and material properties of nickel (Ni) nanoparticle doped tin–bismuth–silver (Sn–Bi–Ag) solder on copper (Cu) substrate

Gain

Zhang

2015

J Mater Sci: Mater Electron

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This paper investigates the influence of adding nickel (Ni) nanoparticles on the microstructure, wettability and material properties of Sn-35Bi-1Ag (wt%) based solders. Material properties such as elastic and shear moduli, stress/strain behavior and electrical resistivity of bulk composite solder were improved significantly in comparison to the corresponding properties of reference solder alloy. The elastic and shear moduli of composite solder increased about 16.8 and 19 % respectively, while the electrical resistivity at room temperature was improved from 23.7 to 25.1 lX cm. On the other hand, in solder joint on Cu substrate, an island-shaped Cu 6 Sn 5 IMC layer was clearly observed at interface for the plain solder/substrate system. Further a prolong reaction, a very thin Cu 3 Sn IMC layer was also formed at the substrate surface. However, in the case of the composite solder/substrate system, a scallop-shaped ternary (Cu, Ni)-Sn IMC layer was observed to be adhered at the interface without formation of Cu 3 Sn IMC layer for the composite solder/substrate system. Moreover, the composite solder/substrate system hindered the growth behavior of IMC layer as well as refined the microstructure which can influence life-span of electronic devices. Additionally, the overall micro-hardness values of composite solder joints exhibited higher values as compare to the plain solder joints due to the second phase strengthening mechanism.

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“…[18,22,23,41,95,98,99] The melting points of the nanocomposite solders generally decreases with an increase in the fraction of the nanoparticles in the matrix. Liu et al reported that Sn-Ag-Cu/nano-SiC showed a reduction in melting point compared to monolithic Sn-Ag-Cu alloy.…”

Section: Melting Pointmentioning

confidence: 99%

“…However, Nai et al did not observe any significant drop in the melting point. [98,99] Shen et al while working on ZrO 2 reinforced solder the reinforcement particles, i.e., ZrO 2 nanoparticles behave as a nucleating agents and promote the nucleation of the matrix during solidification. Therefore, more nucleating sites results in grain refinement and a drop in melting point could be noticed.…”

Section: Melting Pointmentioning

confidence: 99%

Pulse Electrodeposition of Lead-Free Tin-Based Composites for Microelectronic Packaging

Sharma¹,

Das²,

Das³

2016

Electrodeposition of Composite Materials

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This chapter provides a detailed overview of the various Sn-based composites solders reinforced with ceramic nanoparticles. These solders are lead free in nature and are produced by various process like powder metallurgy, ball milling, casting as well as simple and economic pulse co-electrodeposition technique. In this chapter, various electrodeposited composite solders, their synthesis, characterization, and evaluation of various properties for microelectronic packaging applications, such as microstructure, microhardness, density and porosity, wear and friction, electrochemical corrosion, melting point, electrical resistivity, and residual stress of the monolithic Sn-based and (nano)composite solders have been presented and discussed. This chapter is divided into the following sections: such as introduction to microelectronic packaging, synthesis routes for solders and composites, various nanoreinforcement, and the mechanism of incorporation in solder matrix, the pulse co-electrodeposition technique, the various factors affecting composite deposition, and the improved properties of composite solders over monolithic solders for microelectronic packaging applications are also summarized here.

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Reinforcements at nanometer length scale and the electrical resistivity of lead-free solders

Cited by 56 publications

References 32 publications

Nanocomposite SAC solders: morphology, electrical and mechanical properties of Sn–3.8Ag–0.7Cu solders by adding Co nanoparticles

Nanocomposite SAC solders: morphology, electrical and mechanical properties of Sn–3.8Ag–0.7Cu solders by adding Co nanoparticles

Interfacial microstructure, wettability and material properties of nickel (Ni) nanoparticle doped tin–bismuth–silver (Sn–Bi–Ag) solder on copper (Cu) substrate

Pulse Electrodeposition of Lead-Free Tin-Based Composites for Microelectronic Packaging

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