Interfacial microstructure, wettability and material properties of nickel (Ni) nanoparticle doped tin–bismuth–silver (Sn–Bi–Ag) solder on copper (Cu) substrate

Gain, Asit Kumar; Zhang, Liangchi

doi:10.1007/s10854-015-4252-0

Cited by 37 publications

(23 citation statements)

References 43 publications

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“…The thickness of interfacial IMC layer (d) was measured by using the following Equation (1) the average thickness is used as the roughness measurement datum identified as a dotted line in Figure 3. The interface roughness of the IMC layer with a micro interface contour is characterized by its roughness (R), which can be estimated from Equation (2). Z i in Equation (2) presents the deviation of the peaks or troughs of the interface from the average thickness d of the IMC as shown in Figure 3.…”

Section: D=a/lmentioning

confidence: 99%

“…The interface roughness of the IMC layer with a micro interface contour is characterized by its roughness (R), which can be estimated from Equation (2). Z i in Equation (2) presents the deviation of the peaks or troughs of the interface from the average thickness d of the IMC as shown in Figure 3. To reduce measurement error, five random measurement places were selected and the finally result was expressed as the average of these measurements.…”

Section: D=a/lmentioning

confidence: 99%

“…Because of environmental concerns, the use of Sn-Pb alloy has been gradually restricted for its toxicity. Various types of environmental-friendly Sn-based alloys for example, Sn-3.0Ag-0.5Cu [1], Sn-35Bi-1Ag [2], Sn-14Bi-5In [3], Sn-0.7Cu [4], Sn-9Zn [5], Sn-8Zn-3Bi [6] and Sn-58Bi [7] have been introduced for the application of green electronic packaging systems. Among them, SnAgCu solder has been proposed as the most promising substitute for lead-containing solders because of its relatively low melting temperature and its superior mechanical properties.…”

Section: Introductionmentioning

confidence: 99%

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The Interface Microstructure and Shear Strength of Sn2.5Ag0.7Cu0.1RExNi/Cu Solder Joints under Thermal-Cycle Loading

Cao

Zhang

Shi

et al. 2019

Metals

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The interface microstructure and shear strength of Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal-cycle loading were investigated with scanning electron microscope (SEM), energy dispersive spectroscopy (EDS), X-ray diffraction (XRD) and physical and chemical tests. The results show that an intermetallic compound (IMC) layer of Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints evolved gradually from the scalloped into larger wavy forms with increasing number of thermal cycles. The roughness and average thickness of IMC increased with thermal-cycle loading. However, at longer thermal-cycle loading, the shear strength of the joints was reduced by about 40%. The fracture pathway of solder joints was initiated in the solder seam with ductile fracture mechanism and propagated to the solder seam/IMC layer with ductile-brittle mixed-type fracture mechanism, when the number of thermal cycles increased from 100 to 500 cycles. By adding 0.05 wt.% Ni, the growth of the joint interface IMC could be controlled, and the roughness and average thickness of the interfacial IMC layer reduced. As a result, the shear strength of joints is higher than those without Ni. When compared to joint without Ni, the roughness and average thickness of 0.05 wt.% Ni solder joint interface IMC layer reached the minimum after 500 thermal cycles. The shear strength of that joint was reduced to a minimum of 36.4% of the initial state, to a value of 18.2 MPa.

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Section: D=a/lmentioning

confidence: 99%

Section: D=a/lmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

The Interface Microstructure and Shear Strength of Sn2.5Ag0.7Cu0.1RExNi/Cu Solder Joints under Thermal-Cycle Loading

Cao

Zhang

Shi

et al. 2019

Metals

View full text Add to dashboard Cite

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“…After adding Ni nanoparticles into SnBiAg solder, the Bi-rich phase and Ag 3 Sn IMC was refined because the formation of Ni-Sn IMCs could act as nucleation sites and inhibit the grain growth [55]. With the addition of 0.4 wt.% Ag nanoparticles, a mass of dispersed nano-Ag 3 Sn particles formed, which inhibited the grain growth and provided a refined microstructure [56].…”

Section: Microstructurementioning

confidence: 99%

Effect of Nanoparticles Addition on the Microstructure and Properties of Lead-Free Solders: A Review

et al. 2019

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With the development of microelectronic packaging and increasingly specific service environment of solder joints, much stricter requirements have been placed on the properties of lead-free solders. On account of small size effect and high surface energy, nanoparticles have been widely used to improve the microstructure and properties of lead-free solders. Therefore, the composite solders bearing nanoparticles have recently attracted wide attention. This article reviewed the recent research on SnAgCu, SnBi, and SnZn composite solder alloys and introduced the effect of nanoparticles on their microstructure, mechanical properties, wettability, and reliability. The mechanism of nanoparticles strengthening was analyzed and summarized. In addition, the shortcomings and future development trends of nanoparticle-reinforced lead-free solders were discussed, which is expected to provide some theoretical reference for the application of these composite solder in 3D IC package.

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“…Numerous studies [6][7][8] have already demonstrated that one solder with more refined microstructures and thinner interfacial intermetallic compound (IMC) layers usually has a better joint reliability. To achieve this, several research groups are focused on developing composite materials doped with different types of micro-and nano-scale metallic e.g., Ag [9], Ni [10], In [11], Al [12], Co [13]; ceramic e.g., TiO 2 , ZrO 2 , Al 2 O 3 , and TiO 2 etc. [9,[14][15][16] and rare earth (RE) elements [17][18][19].…”

Section: Introductionmentioning

confidence: 99%

Effect of 0.05 wt.% Pr Addition on Microstructure and Shear Strength of Sn-0.3Ag-0.7Cu/Cu Solder Joint during the Thermal Aging Process

et al. 2019

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The evolution of interfacial morphology and shear strengths of the joints soldered with Sn-0.3Ag-0.7Cu (SAC0307) and SAC0307-0.05Pr aged at 150 • C for different times (h; up to 840 h) were investigated. The experiments showed the electronic joint soldered with SAC0307-0.05Pr has a much higher shear strength than that soldered with SAC0307 after each period of the aging process. This contributes to the doping of Pr atoms, "vitamins in alloys", which tend to be adsorbed on the grain surface of interfacial Cu6Sn5 IMCs, inhibiting the growth of IMCs. Theoretical analysis indicates that doping 0.05 wt.% Pr can evidently lower the growth constant of Cu6Sn5 (DCu6), while the growth constant of Cu3Sn (DCu3) decreased slightly. In addition, the electronic joint soldered with SAC0307-0.05Pr still has better ductility than that soldered with SAC0307, even after a 840-h aging process.

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Interfacial microstructure, wettability and material properties of nickel (Ni) nanoparticle doped tin–bismuth–silver (Sn–Bi–Ag) solder on copper (Cu) substrate

Cited by 37 publications

References 43 publications

The Interface Microstructure and Shear Strength of Sn2.5Ag0.7Cu0.1RExNi/Cu Solder Joints under Thermal-Cycle Loading

The Interface Microstructure and Shear Strength of Sn2.5Ag0.7Cu0.1RExNi/Cu Solder Joints under Thermal-Cycle Loading

Effect of Nanoparticles Addition on the Microstructure and Properties of Lead-Free Solders: A Review

Effect of 0.05 wt.% Pr Addition on Microstructure and Shear Strength of Sn-0.3Ag-0.7Cu/Cu Solder Joint during the Thermal Aging Process

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