Relationship between Dissolution Property and Molecular Weight of Positive-tone Novolak Resist

Removal of Novolac Photoresist with Various Concentrations of Photo-active Compound Using H₂/O₂ Mixtures Activated on a Tungsten Hot-wire Catalyst

“…For the photoresist, we used positive-tone novolac photoresists prepared using the ratio shown in Table 1. Solids (novolac resin and PAC) were dissolved in liquid (propylene glycol methyl ether acetate (PGMEA)) at a ratio of 78 wt% (liquid) / 22 wt% (solid) [18,19]. The PAC contents were 0, 9.4, and 18.7 wt% of solids in the photoresist.…”

Enhancement of Photoresist Removal Rate by Using Atomic Hydrogen Generated under Low-pressure Conditions

“…In a past study we achieved a best removal rate of 2.5 μm/min using atomic hydrogen by heating up the catalyst and the substrate [12]. But this rate is not as good as that obtained by using chemicals, which exceeds 3 μm/min [17,18]. The removal rate using oxygen plasma ashing is also about 3 μm/min [19].…”

Enhancing the Novolak resin resist resolution by adding phenol to fractionated resin

“…Previously, we investigated the effects on lithography characteristics of differences in the properties of novolac resists [1][2][3][4]. These properties included average molecular weight, amount of photoactive compound (PAC) added, and the esterification ratio of the PAC.…”

“…(3) Using the model resists prepared in (2), we used an RDA system to obtain development parameters and used Prolith to perform simulations. (4) The results indicate adding phenol improves pattern profiles and DOF compared to the case of no phenol added.…”