Relationship between hardness and grain size in electrodeposited copper films

Hakamada, Masataka; Nakamoto, Yoshiaki; Matsumoto, Hiroshi; Iwasaki, Hajime; Chen, Youqing; Kusuda, Hiromu; Mabuchi, Mamoru

doi:10.1016/j.msea.2006.12.101

Cited by 106 publications

(57 citation statements)

References 38 publications

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“…Note that a nanocrystalline copper with a very small grain size of 31 nm was obtained by electrodeposition method. 11) Inspection of Fig. 1 reveals that there were twins in the electrodeposited copper with a grain size of 3.3 mm, on the other hand, few twins were found in the electrodeposited copper with a grain size of 31 nm and the rolled copper.…”

Section: Resultsmentioning

confidence: 96%

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Comparison of Mechanical Properties of Thin Copper Films Processed by Electrodeposition and Rolling

et al. 2007

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Thin copper films with grain sizes of 31 nm and 3.3 mm were processed by electrodeposition, and their mechanical properties were compared with those of a rolled copper film. The hardness and strength for the electrodeposited copper with a grain size of 3.3 mm were lower than those of the rolled copper with a grain size of 6.3 mm, however, the elongation to failure for the former was larger than that for the latter. Intense (111) texture formation was found for the rolled copper. Therefore, it is suggested that the difference in mechanical properties between the electrodeposited and rolled copper films are related to the texture formation. The electrodeposited copper with a grain size of 31 nm showed higher strength and larger elongation than the rolled copper. The very small grain size of 31 nm gave rise to the excellent mechanical properties.

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Section: Resultsmentioning

confidence: 96%

“…[8][9][10] In particular, the grain size effects should be focused on because nanocrystalline metals can be fabricated by electrodeposition route. 11) One of other methods for fabrication of thin copper films is rolling. In this case, intense texture is often formed.…”

Section: Introductionmentioning

confidence: 99%

Comparison of Mechanical Properties of Thin Copper Films Processed by Electrodeposition and Rolling

et al. 2007

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“…Following fabrication of the PMMA pillar molds, nanocrystalline copper was electroplated into the via-holes. In order to produce pillars with different average grain sizes, three different Youngdahl et al [9] <20~850 Meyers et al [8]~2 5~880 Sander et al [11]~1 6~830* Chen et al [20] <10~1000* Sun et al [21] <20~1100* *Yield strengths were calculated from indentation hardness divided by 3. batches of electroplating solutions based on Hakamada et al [29] were prepared, with their specific chemical compositions listed in Table II. All electroplating solutions consist of copper (II) sulfate pentahydrate (220 g/L) and sulfuric acid (60 g/L).…”

Section: Experimental Methodsmentioning

confidence: 99%

Microstructural and Geometrical Effects on the Deformation Behavior of Sub-micron Scale Nanocrystalline Copper Pillars

Badami

Jahed

Seo

et al. 2015

Metall Mater Trans A

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The effects of microstructure, sample dimensions, and cross-sectional geometry on the deformation characteristics of electroplated nanocrystalline copper sub-micron pillars are investigated. Nanocrystalline copper pillars were produced with four types of geometry-solid core, hollow, c-shaped, and x-shaped-with outer diameters of~1000 or 220 nm and three different average grain sizes (between 5.1 and 49.3 nm). Flow stress results from uniaxial compression tests of 1000-and 220-nm-outer-diameter pillars, with average grain sizes in the range between~32 and 50 nm, revealed there are no observable strength dependences with the pillar cross-sectional geometries. This suggests that they behave with bulk-like character: mechanical properties independent of size and sample geometry. All of the pillar specimens examined exhibit an increase in mechanical strength with reduction of grain sizes, but soften as the crystalline dimensions are smaller than 10 to 20 nm threshold limits. Interestingly, pillars with outer diameters of 220 nm are distinctively softer than the 1000-nm-diameter samples when their grain size is at and below this threshold limit. These results indicate a strength specimen size effect exists for such fine grain copper pillars.

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“…[3][4][5] Electrodeposition is a promising alternative method for obtaining nanocrystalline metals. 6,7) In particular, electrodeposition can be used to fabricate materials in a nonequilibrium state, resulting in the formation of unique microstructures. Therefore, electrodeposition is effective for the production of new ferromagnetic nanocrystalline alloys.…”

Section: Introductionmentioning

confidence: 99%

Ferromagnetic Properties of Co-Cu Alloy with Nanoscale Lamellar Structure

et al. 2009

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Co-Cu alloys containing a nanoscale lamellar structure with a spacing of 3 nm were produced by electrodeposition, and the effects of annealing on the ferromagnetic properties of the electrodeposited Co-Cu alloys were investigated at room temperature. Both the saturation magnetization and the coercivity were decreased by annealing. This is related to a change in the lamellar structure upon annealing. It is suggested that in the d 6 -dependence range of coercivity, the lamellar boundaries play a different role from the grain boundaries.

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Relationship between hardness and grain size in electrodeposited copper films

Cited by 106 publications

References 38 publications

Comparison of Mechanical Properties of Thin Copper Films Processed by Electrodeposition and Rolling

Comparison of Mechanical Properties of Thin Copper Films Processed by Electrodeposition and Rolling

Microstructural and Geometrical Effects on the Deformation Behavior of Sub-micron Scale Nanocrystalline Copper Pillars

Ferromagnetic Properties of Co-Cu Alloy with Nanoscale Lamellar Structure

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