Relationship between phenolic adhesive chemistry and adhesive joint performance: Effect of filler type on fraction energy

Abstract

synopsisThe performance of adhesive bonded joints depends on many factors, one of which is the adhesive formulation. The effects of organic and inorganic fillers upon the fracture toughness of phenol-resorcinol-formaldehyde adhesive in hard maple joints were explored in this study. Analytical techniques (DSC, IR, SEM, and GPC), and solubility studies were employed to relate physical effects to chemical effects of the fillers. The resin showed two distinct stages of cure: (1) a low temperature exotherm associated with resorcinol and paraformaldehyde and (2) a high temperature endotherm associated with the base resin. Filler was found not to affect the cure. Fillers did have a profound effect on the morphology of the wood-adhesive interphase and upon the bulk adhesive properties. These effects, revealed in both SEM and fracture toughness studies, are discussed at length.

Characterization of phenol–urea–formaldehyde resin by inline FTIR spectroscopy

“…The assignment of characteristic peaks was done on the basis of the relevant literature. [23][24][25][26] The spectra in the wave number range of interest for the TMeP synthesis at 60°C are presented in Figure 2. They were collected every 3 min at a resolution of 8 cm…”

The effects of fillers and extenders on the cure properties of phenol–formaldehyde resin as determined by the application of thermal techniques

“…Ebewele et al 3 have examined the effects of various inorganic and organic fillers on the properties of phenol-resorcinol-formaldehyde adhesives. It was reported that these fillers had no effect on adhesive cure; however, the use of the filled adhesives showed a pronounced effect on the morphology of the woodadhesive interphase and on the bulk adhesive properties.…”

Compatibilization of Natural Fibers with Synthetic Polymers Using Triblock Copolymers as Coupling Agents

“…In wood science, the measurement of G c with a DCB configuration was mainly employed to evaluate wood adhesive performances, or wood properties. [33][34][35][36][37][38][39] A symmetric DCB configuration was often employed in these analyses and samples were fractured toward an opening-mode I loading test. Consequently, the mechanics at the interface and the sample geometry were first studied in this manner.…”