2019 IEEE International Electron Devices Meeting (IEDM) 2019
DOI: 10.1109/iedm19573.2019.8993439
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Reliability and Variability of 1S1R OxRAM-OTS for High Density Crossbar Integration

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Cited by 3 publications
(9 citation statements)
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“…This leads a targeted RRAM programming voltage of ~1.5 V to be compatible with logic CMOS to reach the best bitcell density. For more advanced nodes (1× nm nodes), the memory could be integrated in a 1S1R configuration with a backend selector [58,59] to reduce the bitcell size and target higher capacities than the 1T1R architecture allows [60].…”
Section: Filamentary Memorymentioning
confidence: 99%
“…This leads a targeted RRAM programming voltage of ~1.5 V to be compatible with logic CMOS to reach the best bitcell density. For more advanced nodes (1× nm nodes), the memory could be integrated in a 1S1R configuration with a backend selector [58,59] to reduce the bitcell size and target higher capacities than the 1T1R architecture allows [60].…”
Section: Filamentary Memorymentioning
confidence: 99%
“…The Read Voltage Margin variability being the most critical parameter for reliable 1S1R operation [26], both the 1S1R stack and the applied programming conditions must be engineered to guarantee satisfactory 1S1R Read Voltage Margin and reduce its variability while avoiding device early degradation [27]. Fig.…”
Section: S1r Programming and Reading Capabilitiesmentioning
confidence: 99%
“…Chalcogenide glasses serve as the core materials in state-of-the-art three-dimensional (3D) stacking phase-change random-access memory with 1 S 1 R integration scheme. Reversible structural transformation between amorphous and crystalline phases in phase-change materials enables the encoding of digital information in the resistor ( R ) cell. To access or isolate the R cell, the selector ( S ) unit in connection needs to be turned on or off accordingly, , for which reversible and volatile ovonic threshold switching (OTS) in good glass formers, for example, Ge 7 Si 18 As 35 Te 40 and Ge 40 Se 60 , creates several orders of magnitude contrast in electrical conductance, whereas maintaining glassy phases without inducing any observable crystallization. An excellent S unit should provide a large driving current ( I on ) to trigger phase transitions in the R cell and a minimized sneak current ( I off ) to enlarge the programming nonlinearity . A proper OTS voltage ( V th ) and a low hold-on voltage ( V h ) are of necessity to enhance programming reliability and integrating capacity, , when a half-selected scheme is usually adopted to bias the dense cross-point array.…”
Section: Introductionmentioning
confidence: 99%
“…In this regard, multicomponent OTS materials containing rich cross-link elements like Ge, Si, and As are not an ideal option. Although they possess superior thermal stability and good endurance, the small I on , high V th , and sluggish switching speed would be unfavorable. , By comparison, binary OTS materials with B/C/Si/Ge/Al-doped Te-rich compositions exhibit faster switching speed and larger I on , but the increased I off at V th /2 and the resultant small nonlinearity (<∼10 5 ), as well as the narrower programming window (<∼0.2 to 0.3 V) due to close V h and V th , , all wait for further improvements. Among the binary OTS tellurides, amorphous C n Te m and B x Te y have the best and comparable thermal stabilities, , while the B x Te y -based S unit with a bottom electrode contact (BEC) of ∼ (30 nm) 2 showed an order of magnitude lower I off (∼1 nA) than that of C n Te m -based one (∼10 nA). , It is clear that the electrical performances of the B x Te-based S units still need to be optimized, but most importantly, the underlying mechanism of not only the B x Te y but also other binary tellurides is still unclear.…”
Section: Introductionmentioning
confidence: 99%
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