Reliability Assessment Methodology of Power Devices Based on Physics of Failure and Multivariate Copulas

Guo, Wendi; Fu, Guicui; Wan, Bo; Su, Yuezeng

doi:10.1109/phm-qingdao46334.2019.8942887

Cited by 1 publication

(1 citation statement)

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“…Condition Monitoring (CM) is a passive technique for assessing the switch degradation level and the health of the power module [2,10,11]. CM techniques based on physics of failure (PoF) and electrical operational parameters are studied in the literature [2,[12][13][14]. For wire bond (WB)-related failure modes, ON-state Drain-Source voltage [15] and body diode forward voltage [2] were used as the health indicators.…”

Section: Introductionmentioning

confidence: 99%

High-Frequency Non-Invasive Magnetic Field-Based Condition Monitoring of SiC Power MOSFET Modules

2021

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Current distribution anomaly can be used to indicate the onset of package-related failures modes in Silicon Carbide power MOSFET modules. In this paper, we propose to obtain the wire bond’s magnetic field profile using an array of Tunnel Magneto-Resistance (TMR) sensors, and characterise the small changes in the current density distribution to find the onset of the wire bond degradation processes, including wire bond lift-off, wire bond cracking, and wire bond fracture. We propose a novel condition monitoring technique where a non-galvanic high-bandwidth sensing and a reliability model monitor the health of the power switches. We designed a dedicated calibration set-up to examine the sensor array and calibrated to demonstrate the adequate sensitivity to a minimum 5% current anomaly detection in a single wire bond of the switching devices operating with 50 kHz switching frequency. We use a hardware-in-the-loop (HIL) experimental set-up to replicate wire bond-related failures in a 1200V/55A SiC MOSFET power module of a DC/DC Boost converter. Signal conditioning circuits are further designed to amplify and buffer the sensor readings. Experimental results showed the proposed technique is able to detect a wide range of package-related failures.

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