Reliability evaluation on deterioration of power device using coupled electrical-thermal-mechanical analysis

Anzawa, Takashi; Yu, Qiang; Yamagiwa, Masanori; Shibutani, Tadahiro; Shiratori, Masaki

doi:10.1109/theta.2008.5167181

Cited by 7 publications

(1 citation statement)

References 10 publications

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“…Loh et al [13] discovered several models exhibiting mechanical behavior similarity when the stress level was calculated by the full FE model and by the wire loop-removed FE model. Anzawa et al [14] compared the two types of internal connectors, bonding wire and lead frame, using the thermal-electrical and thermalstructure FE analysis mentioned earlier. Ramminger et al [15] utilized the plastic strain calculated by coarse model and enlarged sub-models, together with the Coffin-Manson relation, to predict the thermal fatigue life of wire.…”

Section: Fatigue Model Of Bonding Wirementioning

confidence: 99%

Life Prediction of High-Cycle Fatigue in Aluminum Bonding Wires Under Power Cycling Test

Hung

Liao

Wang

et al. 2014

IEEE Trans. Device Mater. Relib.

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In this paper, a 3-D finite-element (FE) model was established based on real test samples. Coupled electrothermal and thermal-mechanical FE analyses were conducted to analyze the mechanical behavior of bonding wire under cyclic power loading. The current crowding phenomenon may be improved by increasing the wire number. The junction temperature can be decreased by decreasing the joule heat from the current crowding around the bonding wire. The findings suggest that the power module with wire configuration design shall be operated in a higher power load; meanwhile, the identical reliability can be guaranteed. The temperature predicted by the simulation was consistent with the experimental data. Incremental equivalent plastic strain was not observed when the current loading was low. However, the plastic ratio progressively enhanced with the current load. With a high current load, the yielding effect should be considered. Plastic strain dominated the failure mechanism. The concepts of high-and low-cycle fatigue should be incorporated into the life prediction model for modules subjected to low and high current loadings, respectively. After the simulation results were validated with the experimental data, two models for the design of power modules were proposed.

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Section: Fatigue Model Of Bonding Wirementioning

confidence: 99%