Reliability of Electronic Components

Băjenescu, Titu I.; Bazu, M.

doi:10.1007/978-3-642-58505-0

Cited by 56 publications

(25 citation statements)

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“…The following equation [6] relates the temperature swing to the lifetime of the device in cycles where N m is the number of cycles, Φ and a are packaging-related constants, and ∆T is the temperature swing:…”

Section: Cycle Lifetime Of Power Modules and Wire Bondingmentioning

confidence: 99%

Barriers to the Application of High-Temperature Coolants in Hybrid Electric Vehicles

Staunton¹,

Hsu²,

Starke³

2006

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Section: Cycle Lifetime Of Power Modules and Wire Bondingmentioning

confidence: 99%

Barriers to the Application of High-Temperature Coolants in Hybrid Electric Vehicles

Staunton¹,

Hsu²,

Starke³

2006

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“…First the method is presented, which is based on previous procedures developed by the authors for "classical" devices [1], and was adapted for MEMS. In the process of designing the testing programme, all the difficulties and risks of such action are detailed.…”

Section: Introductionmentioning

confidence: 99%

Reliability Accelerated Testing of MEMS Acccelerometers

Bazu

Galateanu

Ilian

et al. 2007

2007 International Semiconductor Conference

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“…T HE RELIABILITY of an electronic component is defined as the ability of performing a required function under given conditions for a stated time [1]. An electronic device fails to fulfill its intended function when its application or environmental condition exceeds its application limit.…”

Section: Introductionmentioning

confidence: 99%

PCM thermal control unit for portable electronic devices: experimental and numerical studies

Alawadhi

Amón

2003

IEEE Trans. Comp. Packag. Technol.

166

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This paper investigates the effectiveness of a thermal control unit (TCU) for portable electronic devices by performing experimental and numerical analyses. The TCU objective is to improve thermal management of electronic devices when their operating time is limited to a few hours. It is composed of an organic phase change material (PCM) and a thermal conductivity enhancer (TCE). To overcome the relatively low thermal conductivity of the PCM, a TCE is incorporated into the PCM to boost its conductivity. The TCU structure is complex, and modeling an electronic device with it requires time and effort. Hence, this research develops approximate, yet effective, solutions for modeling the TCU, which employ effective thermo-physical properties. The TCU component properties are averaged and a single TCU material is considered. This approach is evaluated by comparing the numerical predictions with the experimental results. The numerical model is then used to study the effect of important parameters that are experimentally expensive to examine, such as the PCM latent heat, Stefan number, and heat source power. It is shown that the TCU can provide a reliable solution to portable electronic devices, which avoids overheating and thermally-induced fatigue, as well as a solution which satisfies the ergonomic requirement.

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Reliability of Electronic Components

Cited by 56 publications

References 0 publications

Barriers to the Application of High-Temperature Coolants in Hybrid Electric Vehicles

Barriers to the Application of High-Temperature Coolants in Hybrid Electric Vehicles

Reliability Accelerated Testing of MEMS Acccelerometers

PCM thermal control unit for portable electronic devices: experimental and numerical studies

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