Reliability of Emerging Bonded Interface Materials for Large-Area Attachments

Paret, Paul; DeVoto, Douglas; Narumanchi, Sreekant

doi:10.1109/tcpmt.2015.2499767

Cited by 20 publications

(10 citation statements)

References 22 publications

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“…Paret et al studied the reliability of DBC-Copper plates with an area of 50.8 mm Ã 50.8 mm. Test results proved that sintered-silver samples failed after subsequent thermal cycling 2,300 cycles between À40°C and 150°C (Paret et al, 2016).…”

Section: Introductionmentioning

confidence: 96%

“…However, there are limited studies reporting low-pressure-sintered silver as bonding interface materials for large-area and super-large-area bonding processes (Tan et al, 2018). So far, the most widely acceptable super-large-area bonding process was applying a high pressure (30-40 MPa) to obtain sintering of pre-dried silver particles or flakes at a temperature lower than 300°C (Paret et al, 2016;Schwarzbauer and Kuhnert, 1989). Narumanchi et al (2011) reported on silver-sintered DBC-Copper plates with a super-large area of 50.8 mm Ã 50.8 mm power dies bonded at 280°C and 30 MPa for a few minutes, whereas the edges of samples showed poor bonding areas.…”

Section: Introductionmentioning

confidence: 99%

“…Paret et al reported a warpage of 166 mm, which was observed on the surface of the samples. The possible reason was mismatches in the coefficient of thermal expansion between materials/layers and the resultant thermomechanical stresses (Paret et al, 2016). Besides, an ongoing project of designing 10kv SiC MOSFET module needs to bond DBA substrates larger than 50.8 Â 25.4 mm (DiMarino et al, 2017;DiMarino et al, 2018).…”

Section: Introductionmentioning

confidence: 99%

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Feasibility investigation and characterization of low-pressure-assisted sintered-silver bonded large-area DBA plates

Tan

Chen

et al. 2019

SSMT

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Purpose This paper aims to use nano-silver paste to design a new bonding method for super-large-area direct-bonded-aluminum (DBA) plates. It compared several frequently used bonding methods and proved the feasibility of an optimized low-pressure-assisted double-layer-printed silver sintering technology for large-area bonding to increase the thermal conductivity of power electronic modules with high junction temperature, higher power density and higher reliability. Design/methodology/approach The bonding profile was optimized by using transparent glasses as substrates. Thus, the bonding qualities could be directly characterized by optical observation. After sintering, the bonded DBA samples were characterized by nondestructive X-ray computed tomography system, scanning electron microscopy equipped with an energy dispersive spectrometer. Finally, bonding stress evolution was characterized by shear tests. Findings Low-pressure-assisted large-area double-layer-printed bonding process consisting of six-step was successfully developed to bond DBA substrates with the size of 50.8 × 25.4 mm. The thickness of the sintered-silver bond-line was between 33 and 74 µm with the average porosity of 12.5 per cent. The distribution of shear strength along the length of DBA/DBA bonded sample was from 9.7 to 18.8 MPa, with average shear strength of 15.5 MPa. The typical fracture primarily propagated in the sintered-silver layer and partially along the Ni layer. Research limitations/implications The bonding stress needs to be further improved. Meanwhile, the thermal and electrical properties are encouraged to test further. Practical implications If nano-silver paste can be used as thermal interfacial material for super-large-area bonding, the thermal performance will be improved. Social implications The paper accelerated the use of nano-silver paste for super-large-area DBA bonding. Originality/value The proposed bonding method greatly decreased the bonding pressure.

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Section: Introductionmentioning

confidence: 96%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Feasibility investigation and characterization of low-pressure-assisted sintered-silver bonded large-area DBA plates

Tan

Chen

et al. 2019

SSMT

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“…Among these materials, sintered silver, along with transient liquid-phase bonding, is a leading candidate for replacing solders in novel power electronics packaging designs. In the past, sintered silver made from micron-sized silver particles demonstrated excellent reliability under accelerated thermal cycling conditions [1]. However, the drawback of the high bonding pressure (30 -40 MPa) requirement resulted in its limited applications and necessitated the research and development of novel and simple bonding techniques of sintered silver.…”

Section: Introductionmentioning

confidence: 99%

“…In the past, research at the National Renewable Energy Laboratory (NREL) was focused on characterizing the reliability of sintered silver joints synthesized from micronsized silver particles [1]. Accelerated thermal cycling from -40°C to 150°C was conducted on 50.8-mm x 50.8-mmfootprint test samples, in which Si3N4 substrates were bonded to copper baseplates with sintered silver material.…”

Section: Introductionmentioning

confidence: 99%

Mechanical Characterization Study of Sintered Silver Pastes Bonded in a Double-Lap Configuration

Paret

Major

DeVoto

et al. 2018

ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystem

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Sintered silver-based bonded interfaces are a critical enabling technology for high-temperature, compact, highperformance, and reliable wide-bandgap packages and components. High-pressure (~40 MPa) sintered silver interfaces have been implemented commercially, most notably the commercial products offered by Semikron. To reduce manufacturing complexity, there is significant industry interest in pressure-less sintered silver interfaces. To this end, current formulations of sintered silver paste are comprised of purely nano-sized silver particles or a combination of nano-and micro-sized silver particles/flakes. It is essential to quantify the mechanical properties and determine the reliability of these interfaces prior to use in automotive power electronics applications. In this paper, research efforts at the National Renewable Energy Laboratory, in collaboration with Virginia Polytechnic Institute and State University and an industry partner, in optimizing the synthesis procedure and mechanical characterization of sintered silver double-lap samples are described. These double-lap samples were synthesized using pressure-less sintering techniques. Shear testing was conducted at multiple temperatures and displacement rates on these samples sintered using two types of sintered silver pastes, one of them consisting of nano-silver particles and the other a hybrid paste or a combination of nano-and micron-sized silver flakes, employed in a double-lap configuration. Maximum values of shear stress obtained from the characterization study are reported.

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Feasibility Investigation and Characterization of Liquid Dispersant–Assisted Sintering of Silver to Bond Large‐Area Plates

et al. 2023

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Thermal interface materials (TIMs), which can close the air gaps formed between rough component surfaces and ensure an efficient path for heat transfer, are directly related to the performance and reliability of power modules. [1,2] Conventional TIMs, such as greases, gels, and phase-change materials, are limited in high-temperature electronic packages because of their bottlenecks in heat removal and long-term reliability. [3] Silver paste, as a state-of-the-art TIM, has promising applications in hightemperature power modules due to the excellent thermal conductivity (about 200-300 W mK À1 ) and robust bonding reliability of sintered-silver bondline at elevated temperature, [4][5][6][7] and sinteredsilver packaged power modules are gradually being used in electric vehicles and power grids.The commonly used method to employ silver paste to bond different units in power modules is sintering by temperature profile. Related factors, including the sintering temperature, [8,9] heating rate, [9] sintering time, [10] sintering pressure, [11] and sintering environment, [12,13] have significant effects on the bonding quality. In addition, the bonding quality differs with bonding area too. When the bonding area is small, high bonding quality can be obtained by pressureless sintering process without predrying, and generally the bonding strength decreases with the increasing bonding area. Kim et al. [14] bonded 5 Â 5 mm GaN dies on the direct

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Reliability of Emerging Bonded Interface Materials for Large-Area Attachments

Abstract: NREL prints on paper that contains recycled content.

Cited by 20 publications

References 22 publications

Feasibility investigation and characterization of low-pressure-assisted sintered-silver bonded large-area DBA plates

Feasibility investigation and characterization of low-pressure-assisted sintered-silver bonded large-area DBA plates

Mechanical Characterization Study of Sintered Silver Pastes Bonded in a Double-Lap Configuration

Feasibility Investigation and Characterization of Liquid Dispersant–Assisted Sintering of Silver to Bond Large‐Area Plates

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