2013
DOI: 10.1117/12.2005719
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Reliability of MEM relays for zero leakage logic

Abstract: Micro-electro-mechanical (MEM) relays are an intriguing alternative to transistors for ultra-low-power digital logic applications [1]. This paper investigates various failure modes for logic relays. Experimental results are presented to show that structural fatigue, dielectric charging, and contact stiction are not reliability-limiting issues. Contact resistance instability caused by surface oxidation and contamination is the primary challenge, and can be influenced by device design and operating conditions.

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Cited by 13 publications
(6 citation statements)
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“…Researchers at the University of California, Berkeley has developed 4-and 6-terminal relays that exhibits steep switching behavior, hysteresis, and a large on/off current ratio [5], [6], [62]. In principle, this configuration has the potential to operate at extremely low voltages and may be able to use less energy than CMOS logic [63].…”
Section: Logic Switches and Gatesmentioning
confidence: 99%
“…Researchers at the University of California, Berkeley has developed 4-and 6-terminal relays that exhibits steep switching behavior, hysteresis, and a large on/off current ratio [5], [6], [62]. In principle, this configuration has the potential to operate at extremely low voltages and may be able to use less energy than CMOS logic [63].…”
Section: Logic Switches and Gatesmentioning
confidence: 99%
“…Fig. 5 shows how |V PI,+ | -|V PI,-| and |V RL,+ | -|V RL,-| evolve with the number of on/off cycles [16] for a prototype …”
Section: B Dielectric Chargingmentioning
confidence: 99%
“…A nanoelectromechanical (NEM) switch is one of the promising candidates beyond CMOS [2,[4][5][6][7][8], which takes advantage of the reduced leakage current, and therefore the reduced power consumption and the higher on:off ratio [4]. Moreover, nanoelectromechanical system (NEMS) switches have broad potential applications in extreme environments, such as in exploring aerospace and rescuing nuclear accidents, due to their tolerance to radiation [2], temperature variations [9], and external electric fields [10].…”
Section: Introductionmentioning
confidence: 99%