Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and F
DOI: 10.1109/iemt.1995.526106
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Reliability of novel die attach adhesive for snap curing

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Cited by 4 publications
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“…Furthermore, they generally exhibit high glass transition temperature (Tg), good fracture toughness, excellent substrate adhesion, low shrinkage, low dielectric loss and low moisture uptake [1,2]. For example in aeronautics and aerospace industries some application needs lightweight materials with high temperature service ceiling (due to their high Tg) and low shrinkage render CEs, and cyanate ester resin fulfill these specifications [3][4]. The key advantages of this type of resins are their stiffness, their dimensional stability under extreme environmental conditions like exposure in high temperatures and moisture, their good adhesive and electrical properties [5][6].…”
Section: Introductionmentioning
confidence: 99%
“…Furthermore, they generally exhibit high glass transition temperature (Tg), good fracture toughness, excellent substrate adhesion, low shrinkage, low dielectric loss and low moisture uptake [1,2]. For example in aeronautics and aerospace industries some application needs lightweight materials with high temperature service ceiling (due to their high Tg) and low shrinkage render CEs, and cyanate ester resin fulfill these specifications [3][4]. The key advantages of this type of resins are their stiffness, their dimensional stability under extreme environmental conditions like exposure in high temperatures and moisture, their good adhesive and electrical properties [5][6].…”
Section: Introductionmentioning
confidence: 99%