Reliability of soldered joints in CSPs of various designs and mounting conditions

Sumikawa, M.; Satô, Toshihiko; Yoshioka, C.; Nukii, Takashi

doi:10.1109/6144.926396

Cited by 12 publications

(3 citation statements)

References 7 publications

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“…Differing from soldered joints in conventional packages, such as Quad Flat Packages (QFPs), the small ball‐shaped joints in CSPs cannot be inspected directly (Kariya et al , 1999). Hence, investigations into the reliability of solder joints in CSPs are extremely difficult (Sumikawa et al , 2001). As a matter of fact, very few studies on the reliability of CSP solder joints can be found in the literature.…”

Section: Introductionmentioning

confidence: 99%

The effects of surface finish on the reliability of lead free and tin lead chip scale package solder joints

Huang

Lee

et al. 2005

Soldering &Amp; Surface Mount Technology

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PurposeThe effects of thermal fatigue and printed circuit board (PCB) surface finish on the pull strength, failure modes and reliability of chip scale package (CSP) solder joints were investigated.Design/methodology/approachMechanical pull test, metallographic examination and electrical measurement were used. Tin lead (Sn‐Pb) and lead free (Sn‐Ag‐Cu) alloys were used with Au/Ni and organic solderability preservative (OSP) surface finishes.FindingsThe experimental results showed that the pull strength of the Sn‐Ag‐Cu/(Au/Ni) solder joint did not change noticeably with an increasing number of thermal cycles. However, the pull strength of the Sn‐Pb/(Au/Ni) solder joints drastically degraded and that of the Sn‐Ag‐Cu/OSP and Sn‐Pb/OSP solder joints slightly decreased during thermal cycling. For both Sn‐Ag‐Cu and Sn‐Pb alloys, the solder joint fracture of as‐soldered samples was the main failure mode when an Au/Ni surface finish was used. For the Sn‐Ag‐Cu/(Au/Ni) and Sn‐Ag‐Cu/OSP solder joints, the proportion of component trace tearing considerably decreased, whereas that of PCB trace tearing considerably increased, during thermal cycling. The Weibull lifetimes of the solder joints were increasingly longer in the order of Sn‐Pb/(Au/Ni), Sn‐Pb/OSP, Sn‐Ag‐Cu/OSP, and Sn‐Ag‐Cu/(Au/Ni).Research limitations/implicationsThis was not an exhaustive study and all of the findings are for lead free and tin lead CSP solder joints, which perhaps limits the usefulness of the results elsewhere.Practical implicationsA very useful source of information and impartial advice for engineers planning to conduct a switch from tin lead to lead free technology in their production lines.Originality/valueThis paper fulfils an identified information/resources need and offers practical help to an engineer starting out on an engineering development.

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Section: Introductionmentioning

confidence: 99%

The effects of surface finish on the reliability of lead free and tin lead chip scale package solder joints

Huang

Lee

et al. 2005

Soldering &Amp; Surface Mount Technology

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“…1,2 It is currently being developed for fine pitch technology, high density, high precision and multifunction. [3][4][5][6] The 63A solder alloy powder is applied largely in SMT. In order to satisfy the SMT requirement, there are two important parameters for the 63A solder powders: the shape and the diameter of the particle.…”

Section: Introductionmentioning

confidence: 99%

Influence of atomising gas pressure on 63A solder powder in supersonic atomisation

Zhao²,

Zhao³

2004

Powder Metallurgy

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The atomising gas pressure is one of several important process parameters that affect the characteristics of the powder particles. The work analyses qualitatively the influence of the atomising gas pressure on 63A solder alloy fine powders. Also studied was the mechanism of the effect of the atomising pressure on the base of the air dynamics through the atomising 63A solder alloy experiment with different atomising pressures on the supersonic nozzle. The results indicate that 63A solder alloy fine powders may be attained, which can satisfy the SMT application requirement when the atomising gas pressure is at 0 . 7 MPa.

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“…The thicker the layer is, at a given thermal expansion mismatch, the lower is the shear plane angle and the inclination to formation of cracks. This is well known from reliability investigations of solder joints e.g., between chip components and PCBs where it was found that the number of thermal cycles until failure increases significantly with rising stand-off height [57].…”

Section: Ica For Interconnecting Parts With Dissimilar Thermal Expansmentioning

confidence: 97%

Electrically Conductive Adhesives

Nicolics¹,

Mundlein²

Micro- And Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging

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Electrically conductive adhesives are being used in electronic packaging for several decades. A brief review of the dynamic development of conductive adhesives under the influence of the miniaturization, the adaptation of environmental friendly manufacturing processes is presented. With respect to the importance of isotropically conductive adhesives (ICA), a new contact model to analyze the principle influences of e.g., particle size, particle geometry, and filler content on the percolation threshold is introduced. With this model the arrangement of the particles within a contact is calculated by considering different types of forces (elastic, friction, adhesion, and inertia). Taking into account the electrical properties of the filler particles, the electrical contact behavior including its changes due to aging is investigated. Finally, typical applications of isotropically conductive adhesives are presented. One example shows how the thermal requirements for attaching a GaAs heterojunction power transistor can be fulfilled using an adhesive with an extremely high filler content (thermal conductivity: >60 W/mK). In another case it is demonstrated how extreme thermomechanical requirements resulting from a thermal expansion mismatch of parts of a sealed IR sensor housing can be corresponded using an adhesive with a comparatively low glass transition temperature. A further example shows a packaging concept of a miniaturized, biocompatible multichip module. For mounting both, narrowly spaced SMDs and bare chips, an isotropically conductive adhesive has been applied. 21

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Reliability of soldered joints in CSPs of various designs and mounting conditions

Cited by 12 publications

References 7 publications

The effects of surface finish on the reliability of lead free and tin lead chip scale package solder joints

The effects of surface finish on the reliability of lead free and tin lead chip scale package solder joints

Influence of atomising gas pressure on 63A solder powder in supersonic atomisation

Electrically Conductive Adhesives

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