The effects of surface finish on the reliability of lead free and tin lead chip scale package solder joints

Huang, Meng-Kuang; Lee, Chiapyng; Wu, Pei‐Lin; Tzan, Shyh‐Rong

doi:10.1108/09540910510613501

Cited by 7 publications

(3 citation statements)

References 7 publications

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“…The changes in surface finish add extra concerns in terms of reliability, as most failures of devices occur at the relatively weak intermetallics between the bulk solder and the pads of the components and the PCBs. Recently Huang et al (2005) have conducted a study of the effect of organic solderability preservative (OSP) and electroless nickel immersion gold (ENIG) finishes on the thermal fatigue of chip scale package (CSP) solder joints produced from SAC 305 and SnPb. The results showed that the OSP finish performed better with the SnPb, however there was little difference between the finishes for SAC 305 with ENIG slightly better.…”

Section: Introductionmentioning

confidence: 99%

Surface finish effect on reliability of SAC 305 soldered chip resistors

Collins

Punch²,

Coyle³

2012

Soldering &Amp; Surface Mount Technology

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Purpose -The purpose of this paper is to assess the long-term reliability of lead-free Sn96.5Ag3.0Cu0.5 (SAC305) under accelerated temperature cycling (ATC) conditions. Test vehicles consisted of commercial 2512 ceramic chip resistors soldered to printed circuit boards (PCBs) using three different Pb-free surface finishes: organic solderability preservative (OSP), immersion silver (IAg) and electroless nickel immersion gold (ENIG). Design/methodology/approach -Two populations of solder joints were monitored continuously during a thermal cycle of 08C to 1008C with a ramp rate of 108C/min and a 30 min dwell at the temperature extremes. One population was cycled to 2,500 cycles, the other population was cycled to 8,250 cycles. Failures were defined in accordance with the IPC-9701A industry test guidelines and failure data are reported as characteristic life, h. Microstructural evolution was characterised using metallographic techniques and back-scattered scanning electron microscopy (SEM). Fractography was performed on post-cycled resistors to determine failure mechanisms. Findings -The results showed that the lifetime of the chip resistors could be ranked as follows: OSP . ENIG . IAg after 8,250 thermal cycles, when . 73 per cent of the population had failed. It was found that the relative performance of OSP finishes improved with longer periods of cycling. This was attributed to diffusion of copper into the bulk solder and which subsequently, over time, acted as a dispersion strengthening mechanism. The relatively poor performance of IAg finishes was attributed to void formation. Originality/value -The paper provides new and valuable information to end-users about the long-term reliability of lead-free solder on three commonly used lead-free surface finishes. The performance of each surface finish is explained in terms of microstructural evolution and void formation.

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Section: Introductionmentioning

confidence: 99%

Surface finish effect on reliability of SAC 305 soldered chip resistors

Collins

Punch²,

Coyle³

2012

Soldering &Amp; Surface Mount Technology

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“…With this continuous miniaturization and increasing functionality of electronic components, the microelectronic industry keep moving towards fine pitch devices. Area array components have evolved to meet the demands of the industry and the chip scale package (CSP) is therefore becoming one of the main products in the integrated circuit (IC) industry [2].…”

Section: Introductionmentioning

confidence: 99%

Influence of Difference Solders Volume on Intermetallic Growth of Sn-4.0Ag-0.5Cu/ENEPIG

Azlina

Ourdjini

2016

MATEC Web Conf.

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Abstract. In recent years, portable electronic packaging products such as smart phones, tablets, notebooks and other gadgets have been developed with reduced size of component packaging, light weight, high speed and with enhanced performance. Thus, flip chip technology with smaller solder sphere sizes that would produce fine solder joint interconnections have become essential in order to fulfill these miniaturization requirements. This study investigates the interfacial reactions and intermetallics formation during reflow soldering and isothermal aging between Sn-4.0Ag-0.5Cu (SAC405) and electroless nickel/immersion palladium/immersion gold (EN(P)EPIG). Solder diameters of 300 μm and 700 μm were used to compare the effect of solder volume on the solder joint microstructure. The solid state isothermal aging was performed at 125°C starting from 250 hours until 2000 hours. The results revealed that only (Cu,Ni)6Sn5 IMC was found at the interface during reflow soldering while both (Cu,Ni)6Sn5 and (Ni,Cu)3Sn4 IMC have been observed after aging process. Smaller solder sizes produced thinner IMC than larger solder joints investigated after reflow soldering, whereas the larger solders produced thinner IMC than the smaller solders after isothermal aging. Aging duration of solder joints has been found to be increase the IMC's thickness and changed the IMC morphologies to spherical-shaped, compacted and larger grain size.

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“…In this technology, the proper selection of the surface finishes for the soldering pads on the component and PCB sides, along with that of the solder alloys which are typically Sn-based, is one of the major concerns related to solder joint reliability. [1][2][3][4][5] The most common surface finish on the component side is electrolytic Ni/Au plated over the Cu pad of the flexible substrate. During the reflow process, the Au layer is quickly dissolved into the molten solder and then the Ni layer is exposed to and reacts with the solder.…”

Section: Introductionmentioning

confidence: 99%

Effect of Cross-Interaction between Ni and Cu on Growth Kinetics of Intermetallic Compounds in Ni/Sn/Cu Diffusion Couples during Aging

Hong¹,

Ryu

Park

et al. 2007

Journal of Elec Materi

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The solid-state, cross-interaction between the Ni layer on the component side and the Cu pad on the printed circuit board (PCB) side in ball grid array (BGA) solder joints was investigated by employing Ni(15 lm)/Sn(65 lm)/Cu ternary diffusion couples. The ternary diffusion couples were prepared by sequentially electroplating Sn and Ni on a Cu foil and were aged isothermally at 150, 180, and 200°C. The growth of the intermetallic compound (IMC) layer on the Ni side was coupled with that on the Cu side by the mass flux across the Sn layer that was caused by the difference in the Ni content between the (Cu 1-x Ni x ) 6 Sn 5 layer on the Ni side and the (Cu 1-y Ni y ) 6 Sn 5 layer on the Cu side. As the consequence of the coupling, the growth rate of the (Cu 1-x Ni x ) 6 Sn 5 layer on the Ni side was rapidly accelerated by decreasing Sn layer thickness and increasing aging temperature. Owing to the cross-interaction with the top Ni layer, the growth rate of the (Cu 1-y Ni y ) 6 Sn 5 layer on the Cu side was accelerated at 150°C and 180°C but was retarded at 200°C, while the growth rate of the Cu 3 Sn layer was always retarded. The growth kinetic model proposed in an attempt to interpret the experimental results was able to reproduce qualitatively all of the important experimental observations pertaining to the growth of the IMC layers in the Ni/Sn/Cu diffusion couple.

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The effects of surface finish on the reliability of lead free and tin lead chip scale package solder joints

Cited by 7 publications

References 7 publications

Surface finish effect on reliability of SAC 305 soldered chip resistors

Surface finish effect on reliability of SAC 305 soldered chip resistors

Influence of Difference Solders Volume on Intermetallic Growth of Sn-4.0Ag-0.5Cu/ENEPIG

Effect of Cross-Interaction between Ni and Cu on Growth Kinetics of Intermetallic Compounds in Ni/Sn/Cu Diffusion Couples during Aging

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