2012
DOI: 10.1108/09540911211262520
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Surface finish effect on reliability of SAC 305 soldered chip resistors

Abstract: Purpose -The purpose of this paper is to assess the long-term reliability of lead-free Sn96.5Ag3.0Cu0.5 (SAC305) under accelerated temperature cycling (ATC) conditions. Test vehicles consisted of commercial 2512 ceramic chip resistors soldered to printed circuit boards (PCBs) using three different Pb-free surface finishes: organic solderability preservative (OSP), immersion silver (IAg) and electroless nickel immersion gold (ENIG). Design/methodology/approach -Two populations of solder joints were monitored co… Show more

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Cited by 42 publications
(21 citation statements)
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“…Among them, near-eutectic SAC alloys have established themselves as the interconnect materials of choice for the electronic packaging industry [3][4][5][6][7]. Various SAC alloy systems have been proposed by Japanese (SAC305, short for Sn3.0Ag0.5Cu), EU (SAC387, short for Sn3.8Ag0.7Cu), and US (SAC396, short for Sn3.9Ag0.6Cu) consortiums [8], with the SAC305 alloy widely used by the industry as the most promising candidate for reliable Pb-free solder due to its reliability under thermal cycling [9,10].…”
Section: Introductionmentioning
confidence: 99%
“…Among them, near-eutectic SAC alloys have established themselves as the interconnect materials of choice for the electronic packaging industry [3][4][5][6][7]. Various SAC alloy systems have been proposed by Japanese (SAC305, short for Sn3.0Ag0.5Cu), EU (SAC387, short for Sn3.8Ag0.7Cu), and US (SAC396, short for Sn3.9Ag0.6Cu) consortiums [8], with the SAC305 alloy widely used by the industry as the most promising candidate for reliable Pb-free solder due to its reliability under thermal cycling [9,10].…”
Section: Introductionmentioning
confidence: 99%
“…In electronic packaging, Ag can be used as functional thin films [7], surface finish layers [8,9] on pads and an alloying constituent in solder [10,11]. The reason is that Ag has excellent electrical conductivity, and Ag can lower the melting temperature of Sn-based solder.…”
Section: Introductionmentioning
confidence: 99%
“…SAC 305 solder pastes are usually used in SMT, however, there is still potential for improvements in terms of reliability (Collins et al, 2012;Kotadia et al, 2014). The dependability of the solder joint in long-term service plays a crucial role in the electronic packaging industry; thus, the recently developed Pbfree solder paste now features a much more dependable microstructure (El-Daly and Hammad, 2010), suitable intermetallic layer (IMC), growth rate, and appropriate melting point and mechanical properties (Efzan Mhd Noor and Singh, 2014).…”
Section: Introductionmentioning
confidence: 99%