Reliability of ultra thinning of flip chips for through-silicon analyses

Tsao, Chia Wen; Leroy, Edouard; Saha, Samar K.; Ansorge, L.; Potter, M.E.

doi:10.1109/relphy.2002.996636

2002 IEEE International Reliability Physics Symposium. Proceedings. 40th Annual (Cat. No.02CH37320)

DOI: 10.1109/relphy.2002.996636

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Reliability of ultra thinning of flip chips for through-silicon analyses

Chia Wen Tsao

Edouard Leroy

Samar K. Saha³

et al.

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Cited by 3 publications

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Consistency of optical data from PICA

Lundquist¹,

Coupanec²,

Abraham³

et al.

2003 IEEE International Reliability Physics Symposium Proceedings, 2003. 41st Annual.

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Reliability of ultra thinning of flip chips for through-silicon analyses

Cited by 3 publications

References 15 publications

Consistency of optical data from PICA

Consistency of optical data from PICA

Novel heat spreader for the optical probing of PC board mounted flip chips [microprocessor debug]

Impact of back side circuit edit on active device performance in bulk silicon ICs

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