Reliability Test of Organic Substrate Processed by Newly Desmear Method "PhotodesmearTM"

Endo, Shinichi; Habu, Tomoyuki; Muto, Yasushi; Yabu, Shintaro

doi:10.1109/ectc.2018.00261

Cited by 1 publication

(1 citation statement)

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“…In addition, we also have discussed the mechanism of the smear removal by the VUV irradiation processing in Photodesmear. [9,10] In this paper, we investigated the influence that Photodesmear process gave on the printed circuit board. We produced a custom-designed test vehicle.…”

Section: Introductionmentioning

confidence: 99%

Result of Highly Accelerated Stress Test of Organic Substrate Made by Integrated Dry Process

Endo

Habu

Yabu

2020

Transactions of The Japan Institute of Electronics Packaging

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We made the large experimental tool where Photodesmear could process an actual size of the print circuit board by static irradiation. And we proved that handling of such panel size was technically possible. The connection reliability of the contact via was evaluated after electric copper plating by quick via peel examination. We made a cross-section sample of the contact via holes and the smear removal properties of wet desmear processing and the Photodesmear processing were compared with the residual smear and the oxidation thin layer by observation of the connection interface. The interfacial surface state after desmear processing was analyzed in an X-ray photoelectron spectrum analyzer. We produced the test vehicle using Photodesmear technology and sputtering seed technology. We compared it with the same pattern sample produced by a conventional process. In this paper, we report the results of the highly accelerated temperature and humidity stress test.

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Section: Introductionmentioning

confidence: 99%