Result of Highly Accelerated Stress Test of Organic Substrate Made by Integrated Dry Process

Abstract

We made the large experimental tool where Photodesmear could process an actual size of the print circuit board by static irradiation. And we proved that handling of such panel size was technically possible. The connection reliability of the contact via was evaluated after electric copper plating by quick via peel examination. We made a cross-section sample of the contact via holes and the smear removal properties of wet desmear processing and the Photodesmear processing were compared with the residual smear and the oxidation thin layer by observation of the connection interface. The interfacial surface state after desmear processing was analyzed in an X-ray photoelectron spectrum analyzer. We produced the test vehicle using Photodesmear technology and sputtering seed technology. We compared it with the same pattern sample produced by a conventional process. In this paper, we report the results of the highly accelerated temperature and humidity stress test.