Reliability testing and data analysis of lead‐free solder joints for high‐density packages

Lau, John H.; Hoo, Nick; Horsley, Rob; Smetana, Joe; Shangguan, Dongkai; Dauksher, Walter; Love, Dave; Menis, Irv; Sullivan, Bob

doi:10.1108/09540910410537336

Cited by 29 publications

(25 citation statements)

References 11 publications

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“…This result implies that the reliability of SnAgCu alloys outperform SnPb for small components and vice versa for large components. This conclusion is consistent with the thermal fatigue experimental results that suggested that SnAgCu alloys outperform SnPb at low strain applications and vice versa at high-strain amplitude applications [14][15][16][17][18][19]. Figure 10.…”

Section: Effect Of Thermal Shocksupporting

confidence: 81%

Investigation of the Lead-free Solder Joint Shear Performance

Webster

Pan

Toleno

2007

Journal of Microelectronics and Electronic Packaging

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Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The purpose of this study is to investigate the effects of reflow profile and thermal shock on the shear performance of eutectic SnPb (SnPb) and Sn3.0Ag0.5Cu (SAC305) solder joints. Test boards were assembled with four different sized surface mount chip resistors (1206, 0805, 0603 and 0402). Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb were developed with three levels of peak temperature (12ºC, 22ºC, and 32ºC above solder liquidus temperature, or 230ºC, 240ºC, and 250ºC for SAC 305; and 195ºC, 205ºC, and 215ºC for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). Half of the test vehicles were then subjected to air-to-air thermal shock conditioning from -40 to 125°C. The shear force data were analyzed using the Analysis of Variance (ANOVA). The fracture surfaces were studied using a Scanning Electron Microscopy (SEM) with Energy Dispersive Spectroscopy (EDS). It was found that thermal shock degraded both SnPb and SnAgCu joints shear strength, and that the effect of thermal shock on solder joint shear strength is much more significant than that of reflow profile. The SnAgCu solder joints have weaker shear strength than the SnPb solders. SnAgCu solder joint after thermal shock retains more of its shear strength than that of SnPb for small components and vice versa for larger components.

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Section: Effect Of Thermal Shocksupporting

confidence: 81%

Investigation of the Lead-free Solder Joint Shear Performance

Webster

Pan

Toleno

2007

Journal of Microelectronics and Electronic Packaging

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“…al. [50] reported there were no solder joint failures on the lead-free balled flexBGA with both SnAgCu and SnPb solder pastes on all the SnCu HASL, Ni-Au, and OSP PCBs during temperature cycles from 0 to 100°C for 6,000 cycles.…”

Section: Experimental Results On Bga Packagesmentioning

confidence: 99%

“…al. [50] reported the test results for the Ceramic Column Grid Array (CCGA) packages with both SnAgCu and SnPb solder paste on PCBs with three finishes: Sn-Cu HASL, Ni-Au, and OSP. They found failures on all the three PCBs with SnAgCu, but no failures with SnPb solder paste.…”

Section: Experimental Results On Bga Packagesmentioning

confidence: 99%

Lead-free Solder Joint Reliability – State of the Art and Perspectives

Pan

Wang

Shaddock

2005

Journal of Microelectronics and Electronic Packaging

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There is an increasing demand in replacing tin-lead (Sn/Pb) solders with lead-free solders in the electronics industry due to health and environmental concern. The European Union recently passed a law to ban the use of lead in electronic products. The ban will go into effect in July of 2006. The Japanese electronics industry has worked to eliminate lead from consumer electronic products for several years. Although currently there are no specific regulations banning lead in electronics devices in the United States, many companies and consortiums are working on lead-free solder initiatives including Intel, Motorola, Agilent Technologies, General Electric, Boeing, NEMI and many others to avoid a commercial disadvantage.The solder joints reliability not only depends on the solder joint alloys, but also on the component metallization and PCB metallization. Reflow profile has significant impact on lead-free solder joint performance also because it influences wetting and microstructure of the solder joint. Majority researchers use temperature cycling for accelerated reliability testing since the solder joint failure mainly comes from thermal stress due to CTE mismatch. A solder joint failure could be caused by crack initiation and growth or by macroscopic solder facture.

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“…Though more voids were observed in forward compatibility assemblies for BGAs/CSPs [1], the reliability of forward compatibility assemblies is equivalent or better than the reliability of the SnPb balled BGAs with SnPb solder paste [2,25,32].…”

Section: Forward Compatibilitymentioning

confidence: 99%

“…This included lead-free SnAgCu paste with tin-lead CSP169, CSP208, PBGA256, CBGA256 and 2512 chip resistors. Lau et al concluded that the quality of the SnPb balled FLEXBGA solder joints with lead-free solder paste on Ni-Au PCB is better than that with SnPb solder paste on an OSP PCB with 99 percent confidence level [32]. Note that all studies in forward compatibility assembly used SnAgCu reflow profiles.…”

Section: Forward Compatibilitymentioning

confidence: 99%