Reliability testing of electronic packages in harsh environments

This paper concerns the reliability of thermosonically bonded 25µm Au wires in the combined high temperature with vibration conditions, under which the tests have been carried out on wire bonded 40-pin Dual-in-Line (DIL) High Temperature Co-fired Ceramic (HTCC) electronic packages. Mechanical, optical and electrical analysis has been undertaken in order to identify the failure mechanisms of bonded wires due to the combined testing. The results indicated a decrease in the electrical resistance after a few hours of testing as a result of the annealing process of the Au wire during testing. Shear and pull strength levels remained high in general after testing, showing no significant deterioration due to the test under the combined high temperature and vibration conditions. However, a trend of the variation in the strength values is identified with respect to the combined conditions for all wire bonded packages, which may be summarised as: i) increase of the testing temperature has led to a decrease of both the shear and pull strength of the wire bonds; ii) the mechanical behaviour of the wires is affected due to crystallization that leads to material softening and consequently the deformation of wire. to identify the failure mechanisms of bonded wires due to the combined testing. The results indicated a decrease in the electrical resistance after a few hours of testing as a result of the annealing process of the Au wire during testing. In general, ball shear and wire pull strength levels remained high after testing, showing no significant deterioration due to the tests under the combined high temperature and vibration conditions. However, a trend of the variation in the strength values is identified with respect to the combined conditions for all wire-bonded packages, which may be summarised as: i) increase of the testing temperature has led to a decrease of both the shear and pull strength of the wire bonds; ii) the mechanical behaviour of the wires is affected due to crystallization that leads to material softening and consequently the deformation of wire.

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“…As reported previously [6], [7], [8], the orientation of the wires in respect to the axis of the vibration, results in different failure modes.…”

Section: Mechanical Deformation Of Bonded Wires Due To High Temperatumentioning

confidence: 78%

“…Initial work has been reported by the authors to understand the effects of combined vibration and thermal loadings on wire bonded electronic devices in order to assist to the understanding of the significant degradation due to the combined testing conditions [6][7] [8].…”

Section: Introductionmentioning

confidence: 99%

Mechanical and electrical characterisation of Au wire interconnects in electronic packages under the combined vibration and thermal testing conditions

Mirgkizoudi

Liu

Conway

et al. 2015

Microelectronics Reliability

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“…3. Vibration combined with other downhole factors such as temperature, shock, and resonance have a damaging impact on drilling tool failure and lifetime [4,21,47,[66][67][68]. Table 2 lists research efforts on applying vibration factor in reliability modeling and predictions based on FRBD by statistical modeling, Bayesian method, data mining, Monte Carlo simulation, advanced computing, and analytics methods [17,69,70].…”

Section: Drill String Modeling Optimization Systemmentioning

confidence: 99%

The Application of Downhole Vibration Factor in Drilling Tool Reliability Big Data Analytics—A Review

Ren

Wang

Jiang

et al. 2018

ASCE-ASME Journal of Risk and Uncertainty in Engineering Systems, Part B: Mechanical Engineering

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In the challenging downhole environment, drilling tools are normally subject to high temperature, severe vibration, and other harsh operation conditions. The drilling activities generate massive field data, namely field reliability big data (FRBD), which includes downhole operation, environment, failure, degradation, and dynamic data. Field reliability big data has large size, high variety, and extreme complexity. FRBD presents abundant opportunities and great challenges for drilling tool reliability analytics. Consequently, as one of the key factors to affect drilling tool reliability, the downhole vibration factor plays an essential role in the reliability analytics based on FRBD. This paper reviews the important parameters of downhole drilling operations, examines the mode, physical and reliability impact of downhole vibration, and presents the features of reliability big data analytics. Specifically, this paper explores the application of vibration factor in reliability big data analytics covering tool lifetime/failure prediction, prognostics/diagnostics, condition monitoring (CM), and maintenance planning and optimization. Furthermore, the authors highlight the future research about how to better apply the downhole vibration factor in reliability big data analytics to further improve tool reliability and optimize maintenance planning.

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“…Drilling electronics operate in extremely harsh downhole environments with temperatures exceeding 150C, shock and vibration levels exceeding 15g. The impact of temperature, shock and vibration on the life of electronics is described by Barker et al (1992), Duffek (2004), Garvey et al (2009), Gingerich et al (1999), Lall et al (2005Lall et al ( , 2007, Mirgkizoudi et al (2010), Pecht et al (1999), Vichare (2006), Vijayaragavan (2003), Wassell & Stroehlein (2010), White & Bernstein (2008). Other factors like power cycles, thermal ramp rates, electrical overstress, mechanical stress and manufacturing defects impact reliability of tools, but the factors cannot be accurately measured in downhole drilling environments and encompass high uncertainty.…”

Section: Introductionmentioning

confidence: 99%

“…These factors can act alone or interact with each other to produce several degradation mechanisms that can cause failure. For example, Mirgkizoudi et al (2010) demonstrated through tests that there is significant difference between the lives of electronic components subjected to thermal testing with vibration as compared to those with pure thermal loading. Failure of electronics because of fatigue, corrosion, electromigration, filament formation and dielectric breakdown has been established by the scientific community (e.g.…”

Section: Introductionmentioning

confidence: 99%

A Probabilistic Approach for Reliability and Life Prediction of Electronics in Drilling and Evaluation Tools

et al. 2014

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The capability to predict performance and lifetime of drilling electronics is the key to preventing costly downhole tool failures and ensuring success of any drilling operation. Drilling electronics operate under extremely harsh downhole environments with temperatures beyond 150C and vibration levels exceeding 15g. In addition to temperature and vibration, there are several factors affecting electronic reliability that have high uncertainty and cannot be accurately measured. There is a growing trend in the oil and gas industry to drill faster and operate at higher temperatures and pressures, forcing tools to operate beyond design specifications. This has resulted in increased failure rate leading to higher maintenance costs and system downtime for drilling operators as well as service providers. This paper develops a methodology to estimate the life of drilling electronics by using operational data, drilling dynamics and historical maintenance information. The methodology combines parameter estimation techniques, statistical reliability analysis and Bayesian math in a probabilistic framework. Parameter estimation is used to calibrate statistical equations to field data and probabilistic analysis is used to obtain the likelihood of failure. In the paper, the model parameters are represented as random variables, each with a probability distribution. Drilling electronics under downhole conditions can have several failure modes and each failure mode can be caused by the interaction of several variables. When information on each failure mechanism is not readily available, the failure is expressed in terms of several candidate models. Bayesian updating is used to incorporate real time operational history for a specific part and select the most accurate failure model for that part. Tis is for the first time, a systematic approach is developed for predicting the life of electronics in downhole drilling environments using statistical modeling and probabilistic methods on life cycle history and operational data from the field.

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Reliability testing of electronic packages in harsh environments

Cited by 12 publications

References 1 publication

Mechanical and electrical characterisation of Au wire interconnects in electronic packages under the combined vibration and thermal testing conditions

Mechanical and electrical characterisation of Au wire interconnects in electronic packages under the combined vibration and thermal testing conditions

The Application of Downhole Vibration Factor in Drilling Tool Reliability Big Data Analytics—A Review

A Probabilistic Approach for Reliability and Life Prediction of Electronics in Drilling and Evaluation Tools

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