2019
DOI: 10.1587/elex.16.20190219
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Reliable packaging of Josephson voltage standard circuit for cryocooler operation

Abstract: Reliable and easy fabricated packaging for a Josephson voltage standard circuit was proposed and the thermal stress and temperature distribution in the chip were numerically analyzed. The chip for programmable Josephson voltage standard circuits was bonded with InSn solder to a copper plate to achieve good thermal contact. Although this packaging allowed very good thermal contact, the chip sometimes broke due to thermal stress caused by a difference in the expansion coefficient between silicon and copper. Slit… Show more

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Cited by 6 publications
(3 citation statements)
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“…The series array of 100 SQUIDs improved the signal-to-noise ratio because of the averaged results of the SQUIDs. We quantified the transport properties of the SQUIDs by using a typical instrument [16,19,20]. The flux quantum was trapped as the temperature decreased and while the temperature passed through the superconducting transition point in the presence of an external field (this phenomenon is called "field cooling" (FC)), hereafter referred to as Φ FC .…”
Section: Methodsmentioning
confidence: 99%
“…The series array of 100 SQUIDs improved the signal-to-noise ratio because of the averaged results of the SQUIDs. We quantified the transport properties of the SQUIDs by using a typical instrument [16,19,20]. The flux quantum was trapped as the temperature decreased and while the temperature passed through the superconducting transition point in the presence of an external field (this phenomenon is called "field cooling" (FC)), hereafter referred to as Φ FC .…”
Section: Methodsmentioning
confidence: 99%
“…The series array of 100 SQUIDs improved the signal-to-noise ratio because of the averaged results of the SQUIDs. We quantified the transport properties of the SQUIDs using a typical instrument [16,19,20]. When all the SQUIDs were in the same 𝐼 C state (high/low state), 𝐼 C ± (10%) ≈ 𝐼 C ± (90%).…”
Section: Methodsmentioning
confidence: 99%
“…The residual thermal resistance is not low enough in the most demanding conditions and particular care is required in the design of a chip carrier to reduce thermal gradients, mainly at the interfaces between solid bodies. For JVSs working in the high-vacuum environment of a cryocooler, special cryopackages have been designed [6][7][8][9], exhibiting thermal resistances between chip and cold heat sink of few kelvin per watt. The case of JVS is particularly interesting and challenging: power levels of some tens of milliwatt are generally dissipated within a JVS, possibly causing its actual temperature to differ from that measured with the the sensor by hundreds of millikelvin.…”
Section: Introductionmentioning
confidence: 99%