“…Silicon wafers (Okmetic LMTD, Esbo, Finland) cleaved into 5 × 10‐mm pieces in the (100) crystal direction, 76 × 26 mm Microscope Slides (Menzel‐Gläser, Braunschweig, Germany, 72.2% SiO 2 ) or 40 × 8 mm glass test tubes (Assistent KHG, Sondheim‐Rhön, Germany, approximately 75% SiO 2 ) were cleaned for 5 min at 80°C in distilled (Milli‐Q) water, hydrogen peroxide (30% v/v) and NH 4 OH (25% v/v), 5 : 1 : 1 parts respectively 28, 29. The surfaces were then rinsed ten times in distilled water and incubated for another 5 min at 80°C in distilled water, hydrogen peroxide, and hydrochloric acid (37% v/v), 6 : 1 : 1 parts, respectively.…”