GaP green light emitting p-n junction material with an average quantum efficiency for uncontacted diced diodes in air at 7 A/cm 2 of 0.101% has been reproducibly grown in a vertical dipping system using a modified overcompensation process. This value corresponds to an average efficiency of 0.16% for epoxy encapsulated mesa diodes, which is 60% higher than previously obtained. Mesa diode efficiencies as high as 0.230% at 5 A/cm 2 and 0.67% at ~3'0:0 A/cm 2 were obtained. The low current value is the highest reported to date while the high current value is equal to the highest previously reported. These efficiencies were obtained through the introduction of several modifications in the previous overcompensation growth procedure. It was determined that a large cooling interval, from 900 ~ to 700~ with a corresponding decrease in the temperature at which the p-n junction is formed (850~ was the most important modification that resulted in the efficiency improvement. Minority carrier lifetime measurements revealed spatial variations of the lifetimes in both n-and p-layers. The lifetimes increased with decreasing growth temperature, indicating that LPE growth temperatures as low as possible should be used. Typical values were Th ----200 nsec and Xe ~ 100 nsec at the junction. An analysis of the exit gas from the LPE growth system lets one estimate that as much as ~5 ppm 02 could typically be present in the LPE growth system. Deliberate additions of small oxygen concentrations >10 ppm to the inlet gas produced a pronounced reduction in the quantum efficiency and minority carrier lifetimes while oxygen additions < 10 ppm had no effect on the efficiency or lifetimes.